Hall Effect Sensor Buried Plate Layer Sensitivity
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Solution Overview
Problem
Existing integrated circuits with Hall effect sensors lack sensitivity due to thicker sensor plates, and current manufacturing methods are costly and inefficient, requiring additional steps to produce more sensitive sensors.
Innovation Solution
The integration of a buried plate layer doped with 'N' type dopants within a substrate, overlaid with a cover layer doped with 'P' type dopants, and additional contact points on multiple sides, which reduces the thickness of the Hall effect sensor plate without increasing manufacturing steps, thereby enhancing sensitivity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If the Hall effect sensor plate is made thinner to increase sensitivity, then measurement precision improves, but manufacturing complexity increases
Solution Approach 1:
The sensor plate is segmented into a buried plate layer and a cover layer, allowing the thin sensor plate to be constructed through layer division. The buried plate layer is formed within the substrate while the cover layer is added subsequently, enabling precise thickness control without increasing overall manufacturing complexity.
Solution Approach 2:
The solution transitions from a conventional single-layer plate structure to a multi-layer vertical structure. By adding the cover layer over the buried plate layer, the invention creates a three-dimensional layered architecture that achieves thin plate thickness while maintaining structural integrity through vertical stacking rather than horizontal complexity.
2Measurement precision
If additional manufacturing steps are added to produce thinner sensor plates, then sensitivity increases, but production cost increases
Solution Approach 1:
The formation of the cover layer is merged with existing manufacturing processes. The cover layer is formed using the same doping and layer deposition techniques already employed for other circuit components, combining multiple functions into a single integrated structure without requiring separate production lines or additional costly steps.
Solution Approach 2:
The cover layer serves multiple functions simultaneously: it provides the necessary thickness reduction for sensitivity enhancement, acts as a protective overlayer, and integrates with the doping structure for electrical functionality. This multi-functionality eliminates the need for separate components or processes, reducing overall production cost.
3Measurement precision
If the sensor plate thickness is reduced, then sensitivity to smaller magnetic fields improves, but structural integrity may be compromised
Solution Approach 1:
The thin buried plate layer is nested within the substrate structure, surrounded and supported by the substrate material on all sides. This nesting provides structural reinforcement to the thin plate, preventing mechanical failure while maintaining the reduced thickness necessary for high sensitivity magnetic field detection.
Solution Approach 2:
The sensor structure combines the thin semiconductor plate material with the substrate material and cover layer to create a composite structure. This composite architecture provides the mechanical strength of the substrate and cover materials while maintaining the thin, sensitive detection region of the buried plate layer.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach results in more sensitive Hall effect sensors with thinner plates, allowing for more accurate magnetic field detection and measurement without increasing production costs or complexity.
Implementation Method 1
Hall effect sensors are used to detect and measure magnetic fields. In operation, a current is induced across a Hall effect sensor plate, and that current is deflected when a magnetic flux passes through the plate. The stronger the magnetic flux, the more the current is deflected, and the deflected current produces a voltage difference across the sensor plate perpendicular to the induced current.
Implementation Method 2
Several design features influence the sensitivity of Hall effect sensors, including the length of the Hall effect sensor plate, the carrier concentration of the sensor plate, and the thickness of the sensor plate. Sensitivity is increased by producing a longer plate, a lower carrier concentration, and/or a thinner plate.
Data Source
AI summary
Integrated circuits with a Hall effect sensor and methods for fabricating such integrated circuits are provided. The method includes forming a buried plate layer within a substrate and overlying a substrate base, where the buried plate layer is doped with an “N” type dopant. A cover insulating layer if formed overlying the buried plate layer, and a plurality of contact points are formed adjacent to the cover insulating layer.