Hall Sensor Package Current Rail Design for Measurement Accuracy
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional Hall sensor packages have long current traces leading to high resistance and reduced magnetic field strength due to thick isolation layers, causing sensor drift and inaccurate measurements.
Innovation Solution
A semiconductor chip package design using laminate layers with short current paths and a thin isolation layer between the semiconductor chip and current rail, eliminating the need for a leadframe and reducing material complexity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If conventional Hall sensor packages use long current traces, then the package structure is simple, but the resistance increases and magnetic field strength decreases
Solution Approach 1:
The patent transitions from planar current traces to a three-dimensional current rail structure that extends vertically alongside the semiconductor chip. This dimensional change allows the current path to be shortened while maintaining external connectivity, thereby reducing resistance and enhancing magnetic field strength without compromising package simplicity.
Solution Approach 2:
The current path is segmented into multiple components: external pads, via contacts, and current rails. This segmentation allows optimization of each component's function, with current rails providing a low-resistance vertical current path adjacent to the chip, thereby improving measurement accuracy while managing structural complexity.
2Reliability
If thick isolation layers are used between semiconductor chip and current rail, then manufacturing is easier, but magnetic field strength is reduced causing sensor drift
Solution Approach 1:
The patent changes the thickness parameter of the isolation layer from conventional thick designs to a thin isolation layer. This parameter change reduces the distance between the current rail and semiconductor chip, thereby enhancing magnetic field strength and preventing sensor drift, while still providing adequate electrical isolation.
Solution Approach 2:
The isolation layer is applied locally with varying thickness - thin where needed for magnetic field strength near the current rail, and sufficient where required for electrical isolation. This localized quality approach optimizes both measurement accuracy and manufacturability.
3Reliability
If long current traces are used in conventional packages, then material usage is reduced, but resistance increases leading to signal noise
Solution Approach 1:
The current path transitions from long planar traces to a compact three-dimensional structure using vertical current rails and via contacts. This dimensional transformation shortens the current path length, reducing resistance and signal noise, while the concentrated material usage in vertical structures optimizes conductive material efficiency.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances current path precision, reduces signal noise, and increases magnetic field strength, leading to more accurate magnetic field measurements.
Implementation Method 1
A Hall sensor is a transducer that varies its output voltage in response to a measured magnetic field
Implementation Method 2
Electricity carried through a conductor will produce a magnetic field that varies with current
Data Source
AI summary
A semiconductor chip package and a method to manufacture a semiconductor chip package are disclosed. An embodiment of the present invention comprises a substrate and a semiconductor chip disposed on the substrate and laterally surrounded by a packaging material. The package further comprises a current rail adjacent the semiconductor chip, the current rail isolated from the semiconductor chip by an isolation layer, a first external pad, and a via contact contacting the current rail with the first external pad.