Hall Current Sensor Package With Embedded Trace for Higher Accuracy
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Solution Overview
Problem
Conventional Hall effect current sensors suffer from low sensitivity and accuracy due to the distance between the sensor and the conductive trace, which is exacerbated by noise and complex assembly processes in leadframe-based packages.
Innovation Solution
A method of manufacturing current sensor semiconductor devices where a conductive trace is embedded within the package close to the sensor die, allowing for the design of trace shapes to optimize the magnetic field intensity measured by the Hall sensor, facilitating improved accuracy and sensitivity through concurrent wafer or panel-level processing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If the sensor is placed farther from the conductive strip to simplify assembly, then assembly complexity is reduced, but measurement precision deteriorates due to lower magnetic field intensity
Solution Approach 1:
The patent transitions from external PCB mounting to internal package embedding, moving the conductive trace into a different spatial dimension (inside the package rather than outside). This allows the sensor to be positioned close to the trace while maintaining simple assembly processes through co-packaging of all components.
Solution Approach 2:
The patent merges the sensor die, conductive trace, and package into a single integrated unit. By embedding the trace within the package and mounting the sensor die directly above it, all components are combined into one assembly operation, simplifying manufacturing while achieving close proximity for high measurement precision.
2Measurement precision
If leadframe-based packages are used to redirect current closer to the sensor, then measurement precision improves, but device complexity increases due to complex assembly techniques
Solution Approach 1:
The patent extracts and eliminates the leadframe component entirely from the conventional design. By removing the leadframe and its complex wire bonding requirements, the design achieves close sensor-trace proximity through direct embedding of the trace in the package, reducing assembly complexity while maintaining measurement precision.
Solution Approach 2:
The patent replaces the mechanical leadframe structure with a simplified package-embedded trace design. Instead of using a complex mechanical leadframe system to redirect current, the trace is directly formed and embedded in the package material, substituting a simple fabrication process for a complex mechanical assembly process.
3Measurement precision
If the conductive trace is embedded closer to the sensor die, then measurement precision improves, but manufacturing complexity increases
Solution Approach 1:
The conductive trace is preliminarily formed and embedded in the package material before the sensor die is mounted. This preliminary preparation of the trace position and geometry allows the sensor to be subsequently placed in optimal proximity without requiring complex post-assembly adjustments or operations.
Solution Approach 2:
The package material serves multiple functions: it provides mechanical protection, electrical insulation, and a substrate for embedding the conductive trace. This multi-functionality simplifies manufacturing by combining several roles into a single component, reducing overall process complexity while enabling close sensor-trace integration.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enhances the accuracy and sensitivity of current measurements by reducing noise interference and simplifying the assembly process, while allowing for flexible adjustment of magnetic field intensity to suit various current measurement applications.
Implementation Method 1
Solutions as described herein can be applied to current sensor integrated circuit (IC) semiconductor devices based on Hall effect
Data Source
Figure 1A~1C
Figure 1D~1E
Figure 1F~1G
AI summary
An integrated circuit current sensing device (10), comprises an insulating encapsulation (20) that encapsulates a semiconductor die (14) having integrated therein a Hall current sensor (HS) configured to measure an electric current (I) flowing adjacent an active surface of the semiconductor die (14). Embedded in the insulating encapsulation (20) there is provided an electrically conductive trace (100) having opposed ends providing therebetween a current flow path adjacent the active surface of the semiconductor die (14). First electrically conductive formations (101) extend through the insulating encapsulation (20) towards the opposed ends of the electrically conductive trace (100) embedded in the insulating encapsulation (20, 20', 20"). The first electrically conductive formations (101) are configured to cause (101) an electrical current subject to measurement to flow in the aforesaid current flow path adjacent the active surface of the semiconductor die (14). Second electrically conductive formations (182, 120, 121) extend through the insulating encapsulation (20) towards the active surface of the semiconductor die (14), the second electrically conductive formations (181, 182, 121) are configured to activate the Hall current sensor (HS) integrated in the semiconductor die (14).