Hall Sensor Mounting in Implantable Blood Pumps
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Solution Overview
Problem
Mounting sensors, such as Hall sensors, in implantable blood pumps is challenging due to the need for axial symmetry and assembly processes that avoid mechanical stresses on electrical interconnects, which affects the robustness and stability of the sensor connections.
Innovation Solution
A molded interconnect device with integrated electronic circuit traces is used to mount the Hall sensor on a printed circuit board, featuring recesses that can be filled with adhesive to secure the device, reducing mechanical stress and enhancing the connection robustness by using a form-fit soldered joint and underfill adhesives.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If sensors are mounted in an implantable blood pump, then the pump can monitor rotor position and operate reliably, but the assembly process creates mechanical stresses on electrical interconnects that compromise connection robustness
Solution Approach 1:
The patent divides the sensor mounting function into separate components: a sensor carrier that holds multiple sensors, a circuit board with electrical interconnects, and adhesive layers that bond them together. This segmentation allows each component to be optimized independently and assembled without creating excessive mechanical stress on the interconnects.
Solution Approach 2:
The sensors are pre-mounted on a sensor carrier before being attached to the circuit board. This preliminary arrangement allows for precise positioning and alignment to be established beforehand, ensuring axial symmetry is achieved during assembly without requiring forceful adjustments that would stress the electrical interconnects.
2Measurement precision
If sensors are positioned axially symmetric to the rotor, then accurate rotor position monitoring is achieved, but the assembly process becomes complex and difficult to implement
Solution Approach 1:
The sensor carrier is pre-configured with sensors positioned at precise angular intervals (e.g., 90 degrees apart) before assembly. This preliminary positioning ensures axial symmetry is built into the structure itself, eliminating the need for complex alignment procedures during final assembly while maintaining accurate rotor position monitoring.
Solution Approach 2:
The sensor carrier acts as an intermediary component that simplifies the assembly process. Instead of directly mounting individual sensors to the circuit board at precise angular positions, the pre-assembled carrier with symmetrically positioned sensors is mounted as a single unit, greatly reducing assembly complexity while maintaining measurement precision.
3Stress or pressure
If adhesive is used to mount the sensor carrier, then mechanical stress on interconnects is reduced, but the mounting process requires additional steps and materials
Solution Approach 1:
Adhesive is applied to the sensor carrier or circuit board before assembly, allowing the components to be bonded in a single mounting operation. This preliminary application of adhesive simplifies the manufacturing process by eliminating the need for mechanical fasteners or complex joining procedures, while the adhesive provides sufficient bonding strength without creating mechanical stress on the interconnects.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution allows for accurate positioning of the Hall sensor within the blood pump, reduces mechanical stress on electronic traces, and enhances the stability and robustness of the sensor connection, improving the pump's operational reliability and reducing forces applied during operation.
Implementation Method 1
a molded interconnect device carrying a Hall sensor for transducing a position of a rotor
Data Source
AI summary
Techniques for mounting a sensor are disclosed. In some implementations, a molded interconnect device carries a sensor for transducing a position of a rotor of the implantable blood pump. The molded interconnect device includes one or more integrated electronic circuit traces configured to electrically connect the Hall sensor with a printed circuit board of the implantable blood pump, and the molded interconnect device is configured to be mounted to the printed circuit board.