Hall Sensor Package Layout for Low-Offset Lens Drive Control
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Solution Overview
Problem
Existing semiconductor packages face challenges in miniaturization and temperature stability, leading to increased noise and offset quantities in magnetic sensors, which affect precise control of lens units, especially in high-performance cameras with increased pixel counts, resulting in reduced signal-to-noise ratio and impaired image shake compensation.
Innovation Solution
The semiconductor package employs a staggered arrangement of Hall elements and terminals, combined with point-symmetrical placement and electrode configurations, to cancel out offset quantities and fluctuations due to temperature and humidity, while maintaining a compact design.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the semiconductor package is miniaturized, then the package size is reduced, but the noise and offset quantity in magnetic sensors increase
Solution Approach 1:
The patent applies asymmetry by arranging Hall elements and terminals in a staggered configuration rather than a symmetric grid pattern. Specifically, odd-numbered terminals are arranged along a first line while even-numbered terminals are arranged along a second line offset from the first, creating an asymmetric layout that reduces stress concentration and minimizes offset quantities in the magnetic sensor while maintaining a compact package footprint
Solution Approach 2:
The patent segments the terminal arrangement into multiple lines (first line for odd-numbered terminals, second line for even-numbered terminals) with different pitches. This segmentation allows optimized spacing between terminals of the same type while maintaining appropriate spacing between opposite terminals, reducing overall noise without increasing package size
2Adaptability or versatility
If temperature and humidity vary, then environmental adaptability is improved, but offset quantity and noise in magnetic sensors increase
Solution Approach 1:
The patent implements preliminary anti-action by pre-compensating for temperature and humidity effects through the staggered arrangement of Hall elements and terminals. The asymmetric configuration is designed to pre-counteract the stress and thermal effects that would otherwise generate offset quantities and noise, allowing the magnetic sensor to maintain stability across varying environmental conditions without requiring additional compensation circuits
Solution Approach 2:
The patent applies local quality by creating different spacing configurations in different regions of the package. The pitch between adjacent terminals in the same line is different from the pitch between opposite terminals, and the Hall elements are positioned at specific locations relative to the terminals. This localized variation in spacing and positioning optimizes the magnetic field detection characteristics while minimizing the impact of temperature and humidity variations at each specific location
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration enhances the signal-to-noise ratio and reduces noise interference, enabling precise control of lens units and effective image shake compensation, even under varying environmental conditions.
Implementation Method 1
a magnetic sensor including a plurality of Hall elements arranged in a staggered configuration
Implementation Method 2
a voice coil motor configured to relatively change a position of the holding frame with respect to the base
Data Source
AI summary
A semiconductor package includes a semiconductor chip having Hall elements built therein, and external terminals arranged on one surface side of the semiconductor chip. A first Hall element and a second Hall element are arranged to be point-symmetrical with respect to a center point of the semiconductor package in a plan view. The first Hall element is at least partially covered by a first external terminal among first external terminals in a plan view, and the second Hall element is at least partially covered by a second external terminal among second external terminals in a plan view. A first region covered by the first external terminal of the first Hall element in a plan view and a second region covered by the second external terminal of the second Hall element in a plan view are point-symmetrical with respect to the center point of the semiconductor package in a plan view.