Halogen-Free CEM-3 Copper Clad Laminate with Composite Fillers
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Solution Overview
Problem
Traditional CEM-3 copper clad laminates face challenges in achieving high CTI, heat resistance, and alkali resistance while maintaining punching performance, and they rely on halogen-based materials that are environmentally hazardous and costly to replace.
Innovation Solution
A halogen-free composite-base CEM-3 copper clad laminate is developed, using a filler composition of organic and inorganic materials like aluminum hydroxide, melamine cyanurate, boehmite, barium sulfate, and silicon dioxide, combined with an amine-type curing agent to enhance flame resistance, heat resistance, and punching processability.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If brominated epoxy resin is used to achieve flame resistance, then flame resistance is improved, but environmental harm increases due to dioxin and diphenylene oxide generation
Solution Approach 1:
The patent removes harmful brominated epoxy resin from the composition and replaces it with halogen-free alternatives (aluminum hydroxide, melamine cyanurate, boehmite, barium sulfate). This extraction eliminates the source of dioxin and diphenylene oxide generation while maintaining flame resistance through the synergistic action of the alternative fillers.
Solution Approach 2:
The patent converts potentially harmful combustion waste into beneficial outcomes by using halogen-free fillers that do not generate dioxins or diphenylene oxides. The aluminum hydroxide and melamine cyanurate decompose to form protective char layers that suppress flame spread, transforming the combustion process from harmful to beneficial for fire safety.
2Reliability
If large amount of aluminum hydroxide is added to achieve high CTI performance, then CTI is improved, but heat resistance and alkali resistance deteriorate
Solution Approach 1:
The patent employs a composite filler system combining aluminum hydroxide (for CTI) with heat-resistant inorganic fillers (boehmite, barium sulfate, talcum powder, silicon dioxide). This composite approach allows the material to achieve high CTI performance through aluminum hydroxide while the heat-resistant fillers compensate for its thermal limitations, providing synergistic multi-functional performance.
Solution Approach 2:
Different fillers are assigned to different functional roles within the resin matrix: aluminum hydroxide for electrical insulation (CTI), melamine cyanurate for flame resistance, and heat-resistant inorganic fillers for thermal stability. This functional differentiation allows each component to optimize its local contribution to overall performance.
3Temperature
If linear phenol-formaldehyde is used as curing agent to improve heat resistance, then heat resistance is improved, but punching processing performance deteriorates due to increased brittleness
Solution Approach 1:
The patent changes the chemical parameters of the curing system by using amine-type curing agents instead of linear phenol-formaldehyde. This parameter change modifies the crosslinking density and network structure of the cured resin, achieving a balance between heat resistance and flexibility that preserves punching processing performance while maintaining thermal stability.
4Object-affected harmful factors
If halogen-free fillers are used to replace brominated epoxy resin, then environmental harm is reduced, but achieving balanced flame resistance, heat resistance, and CTI performance becomes more difficult
Solution Approach 1:
The patent uses a composite filler system where each component contributes specific properties: aluminum hydroxide for CTI, melamine cyanurate for flame resistance, and heat-resistant inorganic fillers for thermal stability. This composite approach simplifies the formulation process by providing a ready-made synergistic system that achieves multiple performance targets simultaneously without requiring complex optimization of individual components.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The laminate achieves high CTI (>600V), excellent heat resistance, and improved alkali resistance, meeting lead-free process requirements with balanced performance and reduced environmental impact.
Implementation Method 1
aluminum hydroxide has flame resistance and high CTI
Implementation Method 2
melamine cyanurate is a organic filler with high nitrogen content, which has function of flame resistance
Implementation Method 3
curing agent, wherein the filler composition for surface material comprises
Implementation Method 4
formed by heat pressing after being covered with copper foil on one side or double sides
Data Source
AI summary
The present invention discloses a kind of halogen-free composite-base CEM-3 copper clad laminate (CLL) and its preparation method. In the halogen-free composite-base CEM-3 copper clad laminate, compositions of organic and inorganic fillers are used for both the core material and surface material, and adicyandiamide and diamino diphenyl sulfone compound amine curing agent is employed. The prepared halogen-free flame-resistant copper clad laminate reaches a balance of each performance and has high CTI and heat resistance and good punching processability and alkali resistance. The prepared halogen-free flame-resistant copper clad laminate has CTI performance of >600V, thermal delamination time T288 of >30min, thermal decomposition temperature Td of >340°C, 288°C soldering time of >300s, thereby it meets the requirements of lead-free process.