Halogen-Free Organic Film Composition for Uniform Wafer Coating
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Solution Overview
Problem
Existing organic film materials face challenges in achieving uniform film thickness, filling properties, and suppressing humps during the EBR process, while also avoiding the use of perfluoroalkyl compounds due to environmental restrictions and health concerns.
Innovation Solution
A polymer composition is developed containing a resin, a halogen-free polymer with specific repeating units, and a solvent, which is applied through spin-coating and baking to form an organic film with enhanced in-plane uniformity and filling properties, suppressing humps and avoiding PFAS compounds.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional organic film materials are used, then film formation is possible, but in-plane uniformity and filling property are insufficient
Solution Approach 1:
The patent changes the chemical composition parameters of the organic film material by incorporating specific polymer structures with controlled molecular weights and functional groups. This modifies the film's physical properties to achieve both in-plane uniformity and filling property simultaneously
Solution Approach 2:
The patent uses composite material formulation by combining multiple polymer components with different functions in the organic film composition, where each component contributes specific properties to achieve overall performance improvement in both uniformity and filling
2Manufacturing precision
If perfluoroalkyl compounds are used to improve film properties, then coating performance improves, but environmental and health restrictions apply
Solution Approach 1:
The patent extracts and removes perfluoroalkyl compounds from the organic film material composition, eliminating the harmful substance while maintaining film formation capabilities through alternative polymer structures
Solution Approach 2:
The patent replaces restricted perfluoroalkyl compounds with conventional, environmentally acceptable polymer materials that can achieve similar film formation properties without the environmental persistence and toxicity issues
3Manufacturing precision
If organic film material is applied to achieve filling property, then pattern filling improves, but humps are generated during EBR process
Solution Approach 1:
The patent applies local quality control by designing polymer structures with specific functional groups that provide different properties at different locations within the film, allowing good filling in pattern areas while suppressing hump formation in open areas during the EBR process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The composition enables the formation of an organic film with improved uniformity, filling properties, and hump suppression, suitable for multilayer resist processes in semiconductor manufacturing, enhancing the efficiency and precision of patterning processes.
Implementation Method 1
applied through spin-coating and baking to form an organic film
Implementation Method 2
applied through spin-coating and baking to form an organic film
Implementation Method 3
heating the substrate coated with the composition for forming an organic film at a temperature of 100° C. or higher and 600° C. or lower for 10 to 600 seconds
Data Source
AI summary
A composition for forming an organic film, containing: resin and/or compound (A) for forming organic film; polymer (B) not containing halogen atom and containing repeating unit represented by following formula (1) and repeating unit represented by following formula (1′); and solvent (C), where R2 and R3 independently represent saturated or unsaturated organic group having 1-20 carbon atoms and optionally having substituent, and “y” and “z” independently satisfy 0<y<1 and 0<z<1, wherein y+z=1. This can provide composition for forming organic film making it possible to form film excellent in coating property wherein coating defects, as pinholes on substrate (wafer), film-formability (in-plane uniformity), and filling property, composition not containing fluorine atom and containing particular polymer. Furthermore, the invention can provide method for forming organic film using composition for forming organic film, patterning process using composition for forming organic film, and polymer.