Halogen-Free Inter-Package Connectors for Stack Packages
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Solution Overview
Problem
Current package stack structures face challenges in enhancing integration density and miniaturizing electronic systems while ensuring environmental sustainability, particularly due to the use of halogen-containing materials that can be harmful and inefficient in soldering processes.
Innovation Solution
The development of a stack package incorporating a halogen-free inter-package connector and a fastening element, which includes a thermosetting resin and solder material like tin, silver, and copper, with a method of forming these components that avoids the use of halogen-containing fluxes, utilizing hydrogen or formic acid gas for soldering, and creating an air space for thermal management.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If halogen-containing materials are used in inter-package connectors, then soldering process efficiency is improved, but environmental harm increases
Solution Approach 1:
The patent changes the chemical composition parameters of the flux material by replacing halogen-containing compounds with halogen-free alternatives. This substitution maintains the essential soldering function while eliminating environmental harm, directly resolving the contradiction between manufacturing efficiency and environmental protection
Solution Approach 2:
The patent employs a disposable halogen-free flux material that is applied during the soldering process and then discarded. This consumable approach allows the use of environmentally friendly materials without compromising the soldering efficiency that would otherwise require persistent halogen-containing chemicals
2Quantity of substance
If package stack structure is implemented, then integration density is enhanced, but device complexity increases
Solution Approach 1:
The patent implements a nested package stack structure where multiple semiconductor packages are vertically stacked and interconnected. Each package is contained within a standardized substrate framework, allowing high integration density while managing complexity through modular nesting rather than scattered component placement
Solution Approach 2:
The patent employs universal inter-package connectors and standardized substrate designs that serve multiple functions: electrical interconnection, mechanical support, and thermal management. This multi-functionality reduces the number of separate components needed, thereby enhancing integration density without proportionally increasing device complexity
3Stability of the object's composition
If fastening element is added between packages, then structural stability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent merges the fastening element function with the existing package substrate and connector structures. Rather than adding separate fastening components, the design integrates mechanical attachment capabilities into the inter-package connection architecture itself, improving structural stability while avoiding additional manufacturing steps
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This solution enhances integration density, miniaturizes electronic systems, improves solder joint reliability, and reduces environmental impact by eliminating halogen emissions, while maintaining efficient thermal management and stability.
Implementation Method 1
The fastening element may include a thermosetting resin
Implementation Method 2
The halogen-free inter-package connector may include a solder material
Implementation Method 3
utilizing hydrogen or formic acid gas for soldering
Implementation Method 4
The package may further include an air space disposed between the fastening element and the inter-package connector
Data Source
AI summary
A stack package includes a lower package including a lower package substrate and a lower semiconductor chip disposed on the lower package substrate, an upper package including an upper package substrate and an upper semiconductor chip disposed on the upper package substrate, a fastening element formed between a top surface of the lower semiconductor chip and a bottom surface of the upper package substrate, and a halogen-free inter-package connector connecting the lower package substrate to the upper package substrate.