Halogen-Free Phenolic Resin for Semiconductor Sealing
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Solution Overview
Problem
Phenolic resins with a phenolic hydroxyl group exhibit excellent heat resistance but insufficient flame retardancy, particularly in semiconductor sealing materials and printed circuit boards, which require both properties without using halogen-based flame retardants.
Innovation Solution
A phenolic resin containing a binuclear compound and a trinuclear compound with specific structures, along with a tetranuclear compound, as essential components, which are reacted with quinone and phenolic hydroxyl group-containing compounds under specific conditions to achieve excellent heat resistance and flame retardancy in the cured product.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Temperature
If a phenolic resin containing a binuclear compound and a trinuclear compound is used, then heat resistance is improved, but flame retardancy is insufficient
Solution Approach 1:
The patent uses a composite phenolic resin system comprising binuclear compounds (Formula I), trinuclear compounds (Formula II), and tetranuclear compounds (Formula III) with specific structural characteristics. This composite approach combines multiple nuclear compounds with different molecular structures to achieve both high heat resistance and excellent flame retardancy without halogen-based additives, resolving the contradiction between heat resistance and flame retardancy
2Object-affected harmful factors
If halogen-based flame retardants are used to improve flame retardancy, then flame resistance is enhanced, but environmental safety and electrical properties deteriorate
Solution Approach 1:
The patent converts the traditional approach of using harmful halogen-based flame retardants into a beneficial halogen-free system. By utilizing phenolic resins with specific nuclear compound structures (binuclear, trinuclear, and tetranuclear compounds), the invention achieves superior flame retardancy while maintaining excellent electrical properties and environmental safety, effectively converting a harmful practice into a beneficial solution
3Ease of manufacture
If the molecular structure of phenolic resin is simplified to improve manufacturing ease, then manufacturing precision deteriorates
Solution Approach 1:
The patent employs systematic parameter changes in the molecular structures of the phenolic resin components. By defining specific parameters for the binuclear compounds (Formula I with parameters p, q, j, k), trinuclear compounds (Formula II with parameters r, s, t, l, m, n), and tetranuclear compounds (Formula III), the invention achieves precise control over the resin's properties while maintaining manufacturing feasibility through established phenolic resin synthesis methods
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The phenolic resin exhibits enhanced heat resistance and flame retardancy in the cured product, suitable for semiconductor sealing materials and printed circuit boards, while avoiding the use of halogen-based flame retardants.
Implementation Method 1
a phenolic resin containing a binuclear compound having a specific structure and a trinuclear compound having a specific structure as essential components exhibits excellent heat resistance and flame retardancy in terms of a cured product thereof
Data Source
AI summary
There are provided a compound containing a phenolic hydroxyl group, which exhibits excellent heat resistance and excellent flame retardancy in terms of a cured product thereof, a phenolic resin including the same, a curable composition and a cured product thereof, a semiconductor sealing material, and a printed circuit board. The phenolic resin contains a binuclear compound (X) represented by the following Structural Formula (I), and a trinuclear compound (Y) represented by the following Structural Formula (II) as essential components:wherein each of j and k is 1 or 2, and at least one of j and k is 2;wherein each of l, m and n is 1 or 2, and at least one of l, m, and n is 2.