Halogen-Free Resin Composition for High-Frequency PCBs
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional resin compositions fail to meet the requirements of high frequency applications due to inadequate electrical and physicochemical properties, particularly in terms of dielectric constant, dissipation factor, peeling strength, and thermal stability, while also using environmentally unfriendly halogen-containing flame retardants.
Innovation Solution
A halogen-free resin composition comprising a thermosetting resin system with a vinyl-containing elastomer and a phosphorous-containing flame retardant, specifically compounds of formulas (I) and (II), which provides excellent electrical properties, low dielectric loss, and flame retardance, suitable for high frequency applications.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If halogen-free flame retardants are used to replace halogen-containing flame retardants, then environmental friendliness is improved, but electrical properties (dielectric constant and dissipation factor) deteriorate
Solution Approach 1:
The patent changes the chemical structure parameters of the phosphorous-containing flame retardant by specifying particular molecular formulas (with specific R1, R2, R21, R22, R23, R24 groups and n values) to achieve optimal balance between flame retardancy and electrical properties. This structural parameter optimization ensures low dielectric constant and dissipation factor while maintaining halogen-free composition.
Solution Approach 2:
The patent creates a composite resin composition combining multiple components: thermosetting resin, vinyl-containing elastomer, and specifically structured phosphorous-containing flame retardant. This composite approach synergistically improves electrical properties, peeling strength, and flame retardancy while maintaining environmental friendliness.
2Object-affected harmful factors
If halogen-free flame retardants are used to replace halogen-containing flame retardants, then environmental friendliness is improved, but peeling strength deteriorates
Solution Approach 1:
The patent optimizes the molecular structure parameters of the phosphorous-containing flame retardant (specific formulas with defined R groups and n values) to enhance interfacial adhesion properties, thereby improving peeling strength while maintaining halogen-free composition and environmental friendliness.
Solution Approach 2:
The composite resin system combining thermosetting resin, vinyl-containing elastomer, and optimized phosphorous-containing flame retardant creates synergistic effects that significantly improve peeling strength, overcoming the typical weakness of halogen-free flame retardants.
3Object-affected harmful factors
If halogen-free flame retardants are used to replace halogen-containing flame retardants, then environmental friendliness is improved, but thermal stability deteriorates
Solution Approach 1:
The patent specifies precise molecular structure parameters of the phosphorous-containing flame retardant (formulas with specific R1, R2, R21, R22, R23, R24 groups and n=1 or 2) to enhance thermal stability through optimized molecular architecture, achieving high glass transition temperature while maintaining halogen-free composition.
Solution Approach 2:
The synergistic composite system of thermosetting resin, vinyl-containing elastomer, and structurally optimized phosphorous-containing flame retardant provides exceptional thermal stability, with the flame retardant's specific molecular structure contributing to high glass transition temperature and overall thermal performance.
Data Source
AI summary
A resin composition is provided. The resin composition comprises the following:(a) a resin system, which comprises a thermosetting resin constituent and a vinyl-containing elastomer and has a dissipation factor (Df) of not higher than 0.008 at 10 GHz after curing; and(b) a phosphorous-containing flame retardant, which is a compound of formula (I), a compound of formula (II), or a combination thereof:wherein R1, R2, R21, R22, R23, R24, and n are as defined in the specification.