Halogen-Free Resin Composition for Copper Clad Laminate
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Solution Overview
Problem
Current copper clad laminates face challenges with heat resistance, humidity resistance, and dielectric loss, and existing halogen-free solutions struggle to meet environmental protection standards and processing requirements, particularly with phosphorous-containing resins that produce toxic byproducts and have low heat resistance and fragility.
Innovation Solution
A halogen-free resin composition comprising reactive small molecular polyphenylene oxide, polybenzoxazine resin, phosphorus-containing epoxy resin, composite curing agents, and fillers, combined with a method of fabrication involving solvent dissolution, coating, and vacuum hot pressing to produce a copper clad laminate with improved heat resistance, humidity resistance, and low dielectric loss.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Object-affected harmful factors
If phosphorous-containing epoxy resin is used to achieve flame retarding effect, then flame resistance is improved, but heat resistance deteriorates and water absorption increases
Solution Approach 1:
The patent uses a composite resin system combining phosphorous-containing epoxy resin with polyphenylene oxide and dihydrobenzoxazine. This composite approach allows the phosphorous component to provide flame resistance (V-0 rating) while the polyphenylene oxide and dihydrobenzoxazine components maintain heat resistance and reduce water absorption, resolving the contradiction between flame retardancy and thermal stability
2Temperature
If dihydrobenzoxazine resin is used to increase heat resistance and chemical resistance, then heat resistance is improved, but fire performance deteriorates (cannot achieve V-0 standard)
Solution Approach 1:
The patent merges dihydrobenzoxazine resin with phosphorous-containing epoxy resin in a composite system. The dihydrobenzoxazine provides heat resistance and chemical resistance, while the phosphorous-containing epoxy resin contributes flame retardancy. The synergistic combination allows the final material to achieve both high heat resistance and V-0 fire performance rating
3Object-affected harmful factors
If polyphenyl ether is directly filled into the system, then flame retarding structure is introduced, but homogeneous dispersion deteriorates and processing becomes difficult
Solution Approach 1:
The patent changes the molecular weight parameter of polyphenylene oxide to a low range (500-3000), transforming it from a macromolecular filler that is difficult to disperse into a small molecular compound that can be easily dissolved and homogeneously dispersed in the resin system. This parameter change maintains the flame retarding structure while improving processability and dispersion uniformity
4Ease of operation
If reactive groups are introduced and molecular weight is reduced in polyphenyl ether, then plasticization is achieved, but dielectric constant and dielectric loss increase
Solution Approach 1:
The patent introduces reactive groups (hydroxyl groups) at specific locations in the polyphenylene oxide structure to provide localized plasticization and reactivity. The majority of the molecular structure maintains the low dielectric properties of polyphenylene oxide, while the localized hydroxyl groups enable plasticization and crosslinking without significantly increasing dielectric loss
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves excellent heat resistance, humidity resistance, and low dielectric loss, meeting environmental protection standards and improving processing capabilities, including achieving the V-0 standard in fire resistance tests and better piercing processability.
Implementation Method 1
comprising from 5 to 30 parts by weight of reactive small molecular polyphenylene oxide... from 15 to 65 parts by weight of a phosphorus-containing epoxy resin, from 1 to 25 parts by weight of a composite curing agent
Implementation Method 2
The polymers cannot be plasticized unless the polyphenyl ether molecules are crosslinked to the polymers
Implementation Method 3
from 0 to 100 parts by weight of a filler, and a suitable amount of benzene or ketone solvent
Implementation Method 4
dihydrobenzoxazine per se has a very curing temperature of more than 200° C., so that it is difficult for the sheet materials to be completely cured
Data Source
AI summary
The present invention relate to a halogen-free resin composition and a method for fabricating a halogen-free copper clad laminate using the same. The halogen-free resin composition comprises the following components: reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000, a polybenzoxazine resin, a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, a filler, and a benzene or ketone solvent. The method for fabricating a halogen-free copper clad laminate comprises: Step 1: dissolving reactive small molecular polyphenylene oxide with a number average molecular weight of 500-3000 in a benzene or ketone solvent, adding a polybenzoxazine resin after dissolution, and mixing by stirring, to prepare a solution for use; Step 2: adding a phosphorus-containing epoxy resin, a composite curing agent, a curing promoter, and a filler to the solution for use, and stirring uniformly, to obtain a colloidal solution; Step 3: evenly coating the prepared colloidal solution to E-glass cloth with an even surface and baking, to produce a B-stage partially cured prepreg; and Step 4: cutting the B-stage partially cured prepreg into a suitable size according to the size of a compressor, precisely overlaying, placing a copper foil on and under the laminated B-stage partially cured Prepregs, and pressing in a vacuum hot pressing machine, to obtain a halogen-free copper clad laminate.