Halogen-Free Photosensitive Resin Composition for Semiconductor Devices
Find Innovative SolutionsGenerate Solutions
Solution Overview
Problem
Conventional positive photosensitive resin compositions used in semiconductor and display devices contain halogenated compounds, which pose environmental and health concerns, necessitating the development of halogen-free alternatives.
Innovation Solution
A positive photosensitive resin composition is developed using a polybenzoxazole precursor or polyimide precursor and their copolymers, synthesized by introducing halogen-free monomers, along with a photoactive compound, solvent, and additives, to create a halogen-free composition suitable for semiconductor and display device manufacturing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If halogenated compounds are used in positive photosensitive resin composition, then adhesion and sensitivity are improved, but environmental pollution and health toxicity increase
Solution Approach 1:
The patent changes the chemical composition parameters by replacing halogenated compounds with fluorinated cyclic carbonates and specific amine compounds, maintaining the desired adhesion and sensitivity properties while eliminating harmful halogenated substances. This involves modifying the molecular structure and chemical properties of the resin composition components.
Solution Approach 2:
The patent creates a composite material system combining fluorinated cyclic carbonate compounds with specific amine compounds (aromatic diamines, aromatic polyamines, or aminoalcohols). This composite approach achieves the required performance characteristics while avoiding halogenated compounds, resolving the contradiction between reliability and environmental safety.
2Temperature
If conventional polyimide or polybenzoxazole resins are used, then heat resistance and chemical resistance are achieved, but halogenated compounds must be used which cause environmental issues
Solution Approach 1:
The patent modifies the chemical composition parameters by incorporating fluorinated cyclic carbonates and specific amine compounds that can form polyimide or polybenzoxazole structures without requiring halogenated compounds. This maintains the high-temperature stability and chemical resistance while eliminating environmental harm.
Solution Approach 2:
The patent introduces fluorinated groups at specific positions within the polymer structure (local modification) to achieve the desired thermal and chemical properties without throughout the entire molecular structure requiring halogenated compounds. The fluorinated cyclic carbonate provides localized enhancement of performance.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The halogen-free photosensitive resin composition achieves precise pattern formation and excellent adhesion, sensitivity, and developability, while minimizing environmental impact and toxicity risks.
Implementation Method 1
a photoactive compound, which absorbs light during the exposure step and increases its solubility is used to allow for the precise removal of only the exposed area during the development step
Data Source
AI summary
Provided is a photosensitive resin composition using a polyimide precursor and a benzoxazol precursor copolymer resin that does not contain fluorine, which exhibits a degree of pattern implementation similar to those of existing fluorine-based photosensitive compositions and has the effect of leaving less residues after development.