Halogen Removal Module for Semiconductor Substrate Processing

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Solution Overview

Problem

Residual halogen materials such as fluorine, chlorine, and bromine on semiconductor substrates can cause damage and off-gassing, leading to defects in substrates and equipment corrosion in semiconductor fabrication facilities, affecting manufacturing efficiency and costs.

Innovation Solution

A halogen removal module (HRM) with a controlled processing region that manages halogen off-gassing by maintaining specific humidity and temperature conditions, using a method involving two phases: one at room temperature for fluorine removal and another at elevated temperatures for bromine and chlorine removal, while maintaining the substrate in the same environment throughout the process.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If halogen materials are used in etching processes, then manufacturing capability is improved, but residual halogens cause substrate damage and equipment corrosion

Engineering Contradiction:

Improvemanufacturing capabilityVSAvoidsubstrate damage and equipment corrosion

Core Design Contradiction:

ProductivityVSObject-affected harmful factors

Solution Approach 1:

The patent applies preliminary action by implementing a dedicated halogen removal module that performs halogen off-gassing treatment before substrates enter subsequent fabrication processes. The module uses controlled humidity environments (70-100% RH) and heating elements to accelerate halogen removal, preventing damage to both substrates and equipment in downstream processes.

Inventive Principle:

Principle #10Preliminary action

Solution Approach 2:

The patent uses an intermediary approach by introducing a separate halogen removal module as an intermediate processing step between etching and subsequent fabrication operations. This module acts as a mediator that captures and neutralizes residual halogens through controlled environmental conditions, protecting both substrates and equipment from harm.

Inventive Principle:

Principle #24Intermediary (Mediator)

2Reliability

If substrates are moved between different processing environments for halogen removal, then halogen off-gassing is improved, but substrate fabrication capacity is reduced

Engineering Contradiction:

Improvehalogen off-gassing completenessVSAvoidsubstrate fabrication capacity

Core Design Contradiction:

ReliabilityVSProductivity

Solution Approach 1:

The patent merges the halogen removal function with the existing substrate handling infrastructure by integrating the removal module into the fabrication facility's workflow. The module uses the same substrate transfer mechanisms and maintains compatible environmental conditions, allowing halogen removal to occur within the existing fabrication capacity without requiring separate handling infrastructure.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent applies universality by designing a halogen removal module that can handle multiple substrate types and sizes using the same processing chamber and control system. The module serves multiple functions: halogen removal, substrate heating, and humidity control, all within a single integrated unit that processes substrates continuously without reducing overall fabrication capacity.

Inventive Principle:

Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

Effectively removes residual halogens from substrates, preventing damage and equipment corrosion, thereby improving manufacturing throughput and reducing costs by ensuring complete halogen off-gassing without impacting substrate fabrication capacity.

Implementation Method 1

a humidity control device configured to control a relative humidity within the processing region

Methodology Applied

Scientific EffectHumidity control:

Implementation Method 2

at least one heating device disposed to provide temperature control of the substrate within the processing region

Methodology Applied

Scientific EffectHeating: Heating

Implementation Method 3

for a second period of time following the first period of time, the substrate is exposed to a flow of at least one gas while maintaining a relative humidity in exposure to the substrate within a range extending from about 50% to about 100%, and while maintaining a temperature of the substrate within a range extending from about 60° C. to about 200° C. The second period of time is set to allow for a substantially complete off-gassing of bromine and chlorine from the substrate

Methodology Applied

Scientific EffectThermal desorption: Desorption

Data Source

PatentUS10903065B2Halogen removal module and associated systems and methods

Publication Date: 2021.01.26 LAM RES CORP

AI summary

A chamber is formed to enclose a processing region. A passageway is configured to provide for entry of a substrate into the processing region and removal of the substrate from the processing region. A substrate support structure is disposed within the processing region and configured to support the substrate within the processing region. At least one gas input is configured to supply one or more gases to the processing region. At least one gas output is configured to exhaust gases from the processing region. A humidity control device is configured to control a relative humidity within the processing region. At least one heating device is disposed to provide temperature control of the substrate within the processing region. The processing region of the chamber is directly accessible from a substrate handling module configured to operate at atmospheric pressure.