Halogenated Silane Nucleation Layer Thickness Control

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Solution Overview

Problem

Existing methods for depositing metal silicides using silane-based atomic layer deposition exhibit high growth per cycle and poor thickness control, particularly on structures with high aspect ratios, leading to inadequate control over film thickness and step coverage.

Innovation Solution

A method involving sequential exposure of a substrate to a metal precursor and a halogenated silane in a processing chamber, with specific process regions and gas curtains to form a nucleation layer of tungsten or molybdenum silicide with precise thickness control, followed by bulk metal film deposition using WF6 or MoF6 and hydrogen.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Productivity

If silane-based atomic layer deposition is used to deposit metal silicides, then the deposition rate is high (GPC > 5 Å/cycle), but the thickness control is poor and step coverage is low on high aspect ratio structures

Engineering Contradiction:
Improvedeposition rateVSAvoidthickness control
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The patent changes the chemical parameters of the deposition process by replacing standard silane (SiH4) with halogenated silanes such as SiCl4, SiBr4, or SiI4. This parameter change in the co-reactant chemistry fundamentally alters the reaction kinetics and surface chemistry, enabling both high deposition rates and precise thickness control. The halogenated silanes provide more controlled surface reactions compared to conventional silane, resolving the contradiction between productivity and manufacturing precision.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If silane-based atomic layer deposition is used to deposit metal silicides, then the deposition rate is high (GPC > 5 Å/cycle), but the step coverage on structures with high aspect ratios is low

Engineering Contradiction:
Improvedeposition rateVSAvoidstep coverage
Core Design Contradiction:
ProductivityVSShape

Solution Approach 1:

By changing the chemical parameters to use halogenated silanes, the surface reaction characteristics are improved. The halogenated silanes provide better surface diffusion and more uniform reaction kinetics that enable excellent step coverage on high aspect ratio structures while maintaining high deposition rates, thus resolving the contradiction between productivity and shape quality.

Inventive Principle:
Principle #35Parameter changes

3Quantity of substance

If conventional metal precursor and silane deposition is used, then the growth per cycle is high, but the control over film thickness is poor

Engineering Contradiction:
Improvegrowth per cycleVSAvoidfilm thickness control
Core Design Contradiction:
Quantity of substanceVSManufacturing precision

Solution Approach 1:

The patent applies parameter changes by substituting conventional silane with halogenated silane co-reactants. This chemical parameter change results in more predictable and controllable surface reactions, allowing precise control of film thickness while maintaining appropriate growth rates. The halogenated silanes provide better reaction stoichiometry and surface coverage control, resolving the contradiction between quantity of substance deposited and manufacturing precision of film thickness.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This approach achieves improved growth per cycle control and step coverage, allowing for the formation of nucleation layers with thickness in the range of 5 Å to 100 Å at a controlled rate of 0.1 Å/cycle to 10 Å/cycle, enhancing the precision of metal film deposition.

Implementation Method 1

The substrate surface is sequentially exposed to a first reactive gas and a second reactive gas to form a nucleation layer on the surface. The first reactive gas comprises a metal precursor and the second reactive gas comprises a halogenated silane.

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 2

A metal film is bulk deposited on the nucleation layer by repeating sequential exposure of the nucleation layer to a third reactive gas and a fourth reactive gas to form a bulk metal film of a predetermined thickness.

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Data Source

PatentUS11702742B2Methods of forming nucleation layers with halogenated silanes
Publication Date: 2023.07.18 APPLIED MATERIALS INC
  • US11702742B2 patent drawing
  • US11702742B2 patent drawing
  • US11702742B2 patent drawing

AI summary

Methods for forming a nucleation layer on a substrate. In some embodiments, the processing method comprises sequential exposure to a first reactive gas comprising a metal precursor and a second reactive gas comprising a halogenated silane to form a nucleation layer on the surface of the substrate.