Halosilane Precursor Deposition for Low-Temperature Silicon Layers

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Solution Overview

Problem

Existing semiconductor processing systems face challenges in achieving optimal quality and speed of silicon layer deposition on multiple substrates due to temperature limitations, which can be detrimental to the quality of the deposited layer.

Innovation Solution

A semiconductor processing system is designed with a reaction chamber, a heater, and a silicon precursor source that utilizes halosilane with a specific formula (SiH3-nXn—(SiH2-qXq)p SiH3-mXm) to form a silicon comprising layer on multiple substrates, allowing for improved reactivity at lower temperatures.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If the maximum temperature is limited to protect temperature sensitive layers, then the quality of existing layers is preserved, but the deposition speed and quality of new silicon layer deteriorate

Engineering Contradiction:
Improvequality of deposited layerVSAvoiddeposition speed
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent changes the chemical parameters of the precursor material by using halosilane with specific formulas (SiH3-nXn—(SiH2-qXq)p SiH3-mXm) instead of conventional precursors. This parameter change in the precursor's chemical composition enables effective decomposition and silicon deposition at lower temperatures, thus improving deposition speed without compromising layer quality or damaging temperature-sensitive existing layers.

Inventive Principle:
Principle #35Parameter changes

2Productivity

If conventional silicon precursors are used at high temperatures, then deposition speed is improved, but the quality of temperature sensitive layers deteriorates

Engineering Contradiction:
Improvedeposition speedVSAvoidquality of deposited layer
Core Design Contradiction:
ProductivityVSManufacturing precision

Solution Approach 1:

The invention changes the chemical composition parameters of the silicon precursor to halosilane compounds with controlled halogen content (n+m+q from 1 to 5+q*p). This parameter modification allows the precursor to be highly reactive at lower temperatures, achieving fast deposition speeds while maintaining layer quality and protecting temperature-sensitive structures from thermal damage.

Inventive Principle:
Principle #35Parameter changes

3Manufacturing precision

If halosilane with halogens is used to improve reactivity at lower temperatures, then deposition quality is improved, but toxic effects increase

Engineering Contradiction:
Improvequality of deposited layerVSAvoidtoxicity of halogens
Core Design Contradiction:
Manufacturing precisionVSObject-generated harmful factors

Solution Approach 1:

The patent optimizes the halogen content parameters in the halosilane formula by controlling the values of n, m, q, and p to achieve a balance between reactivity and toxicity. By precisely controlling the halogen-to-silicon ratio, the precursor maintains sufficient reactivity for high-quality deposition at low temperatures while minimizing the concentration of toxic halogen byproducts.

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The invention converts the potentially harmful halogen atoms into beneficial reactive sites that enable low-temperature deposition. The halogen atoms facilitate precursor decomposition and silicon incorporation at lower temperatures, improving deposition quality. The controlled use of halogens transforms what could be a toxic liability into a functional asset for process improvement.

Inventive Principle:
Principle #22Blessing in disguise (Convert harm into benefit)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system effectively forms high-quality silicon layers on multiple substrates even at lower temperatures, enhancing the deposition speed and quality while minimizing the use of toxic halogens.

Implementation Method 1

A silicon precursor source may be constructed and arranged to provide to the reaction chamber a halosilane to form a silicon comprising layer on the plurality of substrates

Methodology Applied
Scientific EffectChemical Vapour Deposition: Chemical Vapour Deposition

Implementation Method 2

a heater configured to heat the reaction chamber to a process temperature

Methodology Applied
Scientific EffectHeating: Heating

Data Source

PatentUS20250059644A1Semiconductor processing system, a semiconductor precursor storage vessel and a method of forming a silicon comprising layer
Publication Date: 2025.02.20 ASM IP HLDG BV
  • US20250059644A1 patent drawing
  • US20250059644A1 patent drawing
  • US20250059644A1 patent drawing

AI summary

A semiconductor processing system and method for depositing silicon layers on a plurality of substrates and a semiconductor precursor storage vessel is disclosed. The system may have a reaction chamber constructed and arranged to receive a boat with a plurality of substrates, a heater configured to heat the reaction chamber to a process temperature, and a silicon precursor source constructed and arranged to provide to the reaction chamber a halosilane.