Heat Assisted Magnetic Recording Head Gimbal Assembly Weight Reduction
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Solution Overview
Problem
Incorporating second-generation actuators into existing head gimbal assemblies for heat assisted magnetic recording heads leads to performance deterioration due to increased weight, vibrations, and reduced shock resistance, limiting slider attachment areas and bonding strength, which compromises recording performance and reliability.
Innovation Solution
A heat assisted magnetic recording head gimbal assembly design featuring a light source unit with a submount and light emitting element, a deformably coupled actuator, and a suspension with reduced flexure and load beam windows, allowing for improved mechanical balance, reduced weight, and enhanced bonding strength between the slider and suspension.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If second-generation actuators are incorporated into existing head gimbal assemblies, then head positioning accuracy is improved, but weight increases leading to increased vibrations and reduced shock resistance
Solution Approach 1:
The patent changes the material composition and structural parameters of the actuator to reduce its mass while maintaining the piezoelectric actuation mechanism. By optimizing the actuator's physical parameters, the design achieves lighter weight that reduces vibrations and improves shock resistance while preserving positioning accuracy.
Solution Approach 2:
The actuator incorporates composite material structures that provide high strength-to-weight ratio. These composite materials enable the actuator to maintain mechanical integrity and actuation performance while significantly reducing mass compared to conventional homogeneous materials.
2Measurement precision
If existing actuators are attached to the suspension, then head positioning control is improved, but the slider attachment area is limited to areas on the trailing side of the dimple, reducing bonding strength
Solution Approach 1:
The patent redistributes the actuator attachment areas across multiple dimensions of the suspension structure, utilizing both longitudinal and lateral directions. This multi-dimensional attachment strategy expands the effective bonding area beyond the limited trailing side region, enhancing slider attachment strength while maintaining positioning control.
Solution Approach 2:
The actuator attachment is divided into multiple discrete bonding regions distributed across the suspension. This segmentation allows the actuator to be anchored at multiple points, increasing overall bonding strength and providing better mechanical distribution without compromising positioning precision.
3Productivity
If heat assisted magnetic recording heads are used, then areal density is improved, but head weight increases by up to 60%, causing increased vibrations and reduced shock resistance
Solution Approach 1:
The patent optimizes the physical parameters of the heat assisted magnetic recording head, including reducing the size and mass of the light source unit and heating elements. By carefully controlling the thermal and mechanical parameters, the design achieves the required heating functionality for areal density improvement while minimizing weight increase.
Solution Approach 2:
The design incorporates counterbalancing structural elements and redistributes mass within the head assembly to offset the additional weight from heat assistance components. This counterweight strategy reduces the net impact on vibration and shock resistance while maintaining the heat assisted recording capability.
4Weight of moving object
If the light source unit is reduced in size and weight, then vibrations and shock resistance are improved, but heat dissipation capability may be compromised
Solution Approach 1:
The patent replaces traditional conduction-based heat dissipation structures with alternative thermal management approaches, such as utilizing the surrounding air bearing environment for convective cooling or incorporating phase change materials. This substitution enables effective heat dissipation from the compact light source unit without requiring large thermal mass or conduction paths.
Solution Approach 2:
The design incorporates phase change materials or mechanisms that absorb and dissipate heat through phase transitions (e.g., evaporation, sublimation). This approach provides high heat dissipation efficiency in a compact form factor, maintaining thermal management capability while minimizing the light source unit size and weight.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances vibration resistance, shock resistance, and recording performance while maintaining heat dissipation, reducing the need for a wider landing zone and improving operational reliability by optimizing the spatial configuration of conductive adhesives and reducing the weight and dimensions of the light source unit.
Implementation Method 1
The light source unit comprises a submount mounted to a light emitting element
Implementation Method 2
A first solder or conductive adhesive, mounted on the first longitudinal side of the submount, is configured to electrically and mechanically connect the submount to a wiring supplying electrical power to the light source unit
Data Source
AI summary
A heat assisted magnetic recording head gimbal assembly comprises a light source unit, a heat assisted magnetic recording head, a suspension, an actuator, and a slider. The light source unit comprises a light emitting element and a submount. The suspension comprises a load beam and a flexure movably coupled with the load beam. The actuator is deformably coupled to the flexure. The slider is supported by the suspension and coupled to the flexure and the light source unit. The slider includes the heat assisted magnetic recording head. First and second solders or conductive adhesives are positioned on opposite longitudinal sides of the light source unit, so that the first solder or conductive adhesive electrically and mechanically connects the submount to a wiring supplying power, while the second solder or conductive adhesive electrically and mechanically connects the light emitting element to the wiring.