Semiconductor Transfer Printing With Two-Step HAMR Alignment

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Solution Overview

Problem

The alignment of a laser diode with a waveguide in HAMR recording heads is challenging, leading to potential misalignment and loss of optical efficiency, which affects the reliability of the HAMR recording head.

Innovation Solution

A two-step alignment method is employed, involving initial alignment between a transfer print head and the semiconductor device using alignment marks, followed by a second alignment during transfer to the HAMR recording head wafer, ensuring precise placement of the laser diode relative to the waveguide.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Manufacturing precision

If a single alignment method is used in transfer printing, then the process is simpler and faster, but the alignment accuracy between laser diode and waveguide deteriorates

Engineering Contradiction:

Improvealignment accuracyVSAvoidalignment process complexity

Core Design Contradiction:

Manufacturing precisionVSDevice complexity

Solution Approach 1:

The alignment process is divided into two distinct steps: first aligning the transfer print head with the semiconductor device substrate using alignment marks, then aligning the transfer print head with the HAMR recording head wafer. This segmentation allows each alignment operation to be optimized independently, achieving high precision without overwhelming complexity

Inventive Principle:

Principle #1Segmentation

Solution Approach 2:

Alignment marks are pre-defined on both the semiconductor device substrate and the HAMR recording head wafer before the transfer printing process. The transfer print head is pre-aligned with these marks in the first alignment step, establishing a precise reference framework that ensures accurate final placement of the laser diode relative to the waveguide

Inventive Principle:

Principle #10Preliminary action

2Productivity

If the laser diode is misaligned with the waveguide, then assembly is easier and faster, but optical efficiency deteriorates

Engineering Contradiction:

Improveassembly speedVSAvoidoptical efficiency

Core Design Contradiction:

ProductivityVSLoss of energy

Solution Approach 1:

The patent replaces manual or simple mechanical alignment methods with a more sophisticated optical-mechanical alignment system using alignment marks and precision positioning. This substitution maintains assembly speed while dramatically improving alignment accuracy to prevent optical efficiency loss

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The transfer printing process utilizes pneumatic or hydraulic mechanisms to precisely position and transfer the laser diode to the waveguide. This controlled transfer mechanism, combined with the two-step alignment method, ensures both rapid assembly and precise alignment, preventing optical efficiency deterioration

Inventive Principle:

Principle #29Pneumatics and hydraulics

Data Source

PatentUS12462833B1Alternative alignment technique for semiconductor device transfer print process

Publication Date: 2025.11.04 SEAGATE TECH LLC

AI summary

A method of aligning a semiconductor device for use in a storage device disclosed herein includes providing a semiconductor device on a first substrate. The first substrate includes a first alignment mark. A recording head comprising a second alignment mark is provided on a second substrate. A transfer print head comprising a third alignment mark is also provided. The transfer print head is aligned to the semiconductor device on the first substrate. After the transfer print head is aligned to the semiconductor device, the semiconductor device is transfer printed from the first substrate onto the second substrate. The transfer printing includes aligning the third alignment mark on the transfer print head to the second alignment mark on the second substrate.