Handheld Bonding Tester Using Connector Shells for Avionics Ground Checks

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Solution Overview

Problem

Modern aircraft require proper electrical bonding for avionics units to function correctly, but existing methods are cumbersome and prone to operator error, and lack of periodic checks lead to potential disruptions from radiated fields and lightning transients.

Innovation Solution

A handheld bonding test system that uses a current pulse source and differential voltage measurement to verify the conductive path between avionics units and a conductive shelf, providing a pass or fail indication without requiring specific configuration or paint stripping, utilizing connector shells to test grounding without interacting with connector pins.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Measurement precision

If expensive ground support equipment is used to check avionic units for bonding, then measurement precision is improved, but device complexity and cost increase

Engineering Contradiction:
Improvebonding verification accuracyVSAvoidtest equipment complexity
Core Design Contradiction:
Measurement precisionVSDevice complexity

Solution Approach 1:

The patent replaces expensive, complex ground support equipment with a simple handheld bonding tester that uses readily available connector shells and basic electronic components (current pulse source, voltmeter, amplifier, comparator) to achieve accurate bonding verification through differential voltage measurement

Inventive Principle:
Principle #27Cheap short-living objects (Disposable)

Solution Approach 2:

The invention extracts the essential bonding verification function from complex ground support equipment by isolating the key measurement principle (differential voltage during current pulse) and implementing it in a simplified handheld device that connects through existing connector shells without requiring specialized test equipment

Inventive Principle:
Principle #2Taking out (Extraction)

2Measurement precision

If cumbersome probes and complex setup procedures are used, then measurement precision may be maintained, but ease of operation deteriorates

Engineering Contradiction:
Improvebonding verification accuracyVSAvoidoperator ease of use
Core Design Contradiction:
Measurement precisionVSEase of operation

Solution Approach 1:

The handheld bonding tester is designed to be self-contained with all necessary components (current pulse source, voltmeter, amplifier, comparator, power source) integrated into a single portable unit that operators can use independently without requiring complex setup procedures, specialized training, or additional support equipment

Inventive Principle:
Principle #25Self-service

Solution Approach 2:

The bonding tester utilizes existing connector shells and aircraft ground connections to perform bonding verification, making the device universally applicable to various avionics units without requiring unit-specific configurations, paint stripping, or specialized test fixtures

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Reliability

If periodic bonding checks are not performed, then loss of time is reduced, but reliability deteriorates due to potential disruptions from radiated fields and lightning transients

Engineering Contradiction:
Improveavionics system reliabilityVSAvoidtime for periodic checks
Core Design Contradiction:
ReliabilityVSLoss of time

Solution Approach 1:

The handheld bonding tester enables periodic bonding checks to be performed easily and quickly during maintenance intervals, allowing operators to verify grounding integrity at scheduled times without significant time investment, thereby maintaining protection against radiated fields and lightning transients

Inventive Principle:
Principle #19Periodic action

Solution Approach 2:

The bonding tester allows preventive bonding verification to be performed during routine maintenance before potential disruptions occur, enabling early detection of degraded bonding paths and allowing corrective action to be taken before radiated fields or lightning transients can cause system failures

Inventive Principle:
Principle #10Preliminary action

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The system ensures reliable and efficient verification of proper grounding, reducing operator error and improving system readiness by providing a simple, accurate method to check the bonding path without the need for expensive equipment or complex setup.

Implementation Method 1

a bonding path between a first connector shell and a second connector shell. The bonding path includes a first unit connector shell of a first unit, a first unit chassis of the first unit, a second unit chassis of a second unit, and a second unit connector shell of the second unit

Methodology Applied
Scientific EffectElectrical Resistance: Electrical Resistance

Implementation Method 2

providing a signal to a voltmeter. The voltmeter is configured to measure a voltage difference between a first connector shell and a second connector shell

Methodology Applied
Scientific EffectVoltage measurement: Ohm's Law

Data Source

PatentUS11255923B2Handheld electrical bonding test system
Publication Date: 2022.02.22 TEXTRON INNOVATIONS INC
  • US11255923B2 patent drawing
  • US11255923B2 patent drawing
  • US11255923B2 patent drawing

AI summary

An electrical bonding test device, including a test system circuit configured to generate a current pulse for ground bonding testing of subject units, a first test system connector configured to provide an electrical connection between a first unit connector shell of a first unit of the subject units and the test system circuit and to pass the current pulse to the first unit connector shell during the ground bonding testing, and a second test system connector configured to provide an electrical connection between a second unit connector shell of a second unit of the subject units and a first node of the test system circuit. The test system circuit is further configured to provide an indication indicating whether a bonding path through the subject units is a conductive path having a resistance below a resistance threshold.