Handheld Device Thermal Management Using Joule Heating
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Solution Overview
Problem
Handheld computer devices face malfunctions in subzero temperatures due to inadequate thermal management, with existing solutions adding bulk and complexity, and increasing power requirements.
Innovation Solution
A method and apparatus that delay the start of normal operation and apply a heating current to handheld device subsystems based on their thermal signature, using a thermal management module to allocate power efficiently and maintain component functionality without additional heating infrastructure.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If auxiliary heating sources or component heating infrastructure are incorporated within the handheld device enclosure, then proper functioning of components in subzero environments is achieved, but physical bulk, heating infrastructure complexity, and peak power requirements increase
Solution Approach 1:
The invention enables existing operational components to generate heat for warming the device enclosure during startup in subzero environments. Instead of adding dedicated heating infrastructure, the system utilizes the natural operational heat from components like the display backlight, processor, or motor to warm the enclosure, allowing the device to become operational without requiring separate heating elements, thermostats, or control circuits.
Solution Approach 2:
The invention makes existing operational components serve dual functions: their primary function and heat generation for enclosure warming. For example, the display backlight or motor during startup not only performs their intended operations but also generates thermal energy to warm the enclosure, eliminating the need for dedicated single-function heating components and reducing overall system complexity.
2Reliability
If auxiliary heating sources or component heating infrastructure are incorporated within the handheld device enclosure, then proper functioning of components in subzero environments is achieved, but physical bulk increases
Solution Approach 1:
The invention enables existing operational components to generate heat for warming the device enclosure during startup in subzero environments. Instead of adding dedicated heating infrastructure, the system utilizes the natural operational heat from components like the display backlight, processor, or motor to warm the enclosure, allowing the device to become operational without requiring separate heating elements, thermostats, or control circuits.
Solution Approach 2:
The invention makes existing operational components serve dual functions: their primary function and heat generation for enclosure warming. For example, the display backlight or motor during startup not only performs their intended operations but also generates thermal energy to warm the enclosure, eliminating the need for dedicated single-function heating components and reducing overall system complexity.
3Reliability
If auxiliary heating sources or component heating infrastructure are incorporated within the handheld device enclosure, then proper functioning of components in subzero environments is achieved, but peak power requirements increase
Solution Approach 1:
The invention enables existing operational components to generate heat for warming the device enclosure during startup in subzero environments. Instead of adding dedicated heating infrastructure, the system utilizes the natural operational heat from components like the display backlight, processor, or motor to warm the enclosure, allowing the device to become operational without requiring separate heating elements, thermostats, or control circuits.
Solution Approach 2:
The invention makes existing operational components serve dual functions: their primary function and heat generation for enclosure warming. For example, the display backlight or motor during startup not only performs their intended operations but also generates thermal energy to warm the enclosure, eliminating the need for dedicated single-function heating components and reducing overall system complexity.
4Temperature
If component heating infrastructure is incorporated within the handheld device, then heating capability is provided, but inherent reliability decreases due to increased complexity
Solution Approach 1:
The invention enables existing operational components to generate heat for warming the device enclosure during startup in subzero environments. Instead of adding dedicated heating infrastructure, the system utilizes the natural operational heat from components like the display backlight, processor, or motor to warm the enclosure, allowing the device to become operational without requiring separate heating elements, thermostats, or control circuits.
Solution Approach 2:
The invention makes existing operational components serve dual functions: their primary function and heat generation for enclosure warming. For example, the display backlight or motor during startup not only performs their intended operations but also generates thermal energy to warm the enclosure, eliminating the need for dedicated single-function heating components and reducing overall system complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Ensures proper functioning of handheld device components in cold environments by efficiently allocating power for heating, reducing bulk and complexity, and maintaining operational reliability.
Implementation Method 1
applying a heating current to heat the at least one functional subsystem of the handheld device
Data Source
AI summary
A method and apparatus for thermal management of components and functional subsystems of a handheld device, including for a peripheral device electrically coupled to thereto. A power source provides power to a plurality of functional subsystems of the handheld device and optionally the peripheral device. The components and functional subsystems comprise predetermined thermal signatures.


