Handle Integrated Heat Pipe Passive Cooling

Solution Overview

Problem

Conventional cooling methods for portable electronic devices, which rely on fans and heat sinks, face challenges such as reduced battery life and increased noise due to high power consumption and noise levels, especially in compact designs where thermal management becomes critical.

Innovation Solution

The integration of a handle with a heat pipe system that includes a heat receiving, conducting, and dissipating portion, where the handle is vented to enhance airflow and is rotatably connected to the device for improved thermal management, eliminating the need for active cooling systems like fans.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If fans are utilized to cool components, then heat dissipation is improved, but battery life is significantly lowered

Engineering Contradiction:

Improveheat dissipationVSAvoidbattery life

Core Design Contradiction:

TemperatureVSUse of energy by moving object

Solution Approach 1:

The heat pipe system operates passively using phase change of working fluid (evaporation at hot end, condensation at cold end) to transfer heat without requiring external power or moving parts. The handle structure with integrated vents provides natural convection cooling pathways, eliminating the need for powered fans while maintaining effective heat dissipation.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces the mechanical fan-based active cooling system with a passive heat pipe system that uses thermodynamic phase change and natural convection. This substitution eliminates moving parts and power consumption while maintaining heat dissipation functionality through the integrated handle structure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

2Temperature

If fans are utilized to cool components, then heat dissipation is improved, but noise level increases

Engineering Contradiction:

Improveheat dissipationVSAvoidnoise level

Core Design Contradiction:

TemperatureVSObject-generated harmful factors

Solution Approach 1:

The heat pipe system operates passively using phase change of working fluid (evaporation at hot end, condensation at cold end) to transfer heat without requiring external power or moving parts. The handle structure with integrated vents provides natural convection cooling pathways, eliminating the need for powered fans while maintaining effective heat dissipation.

Inventive Principle:

Principle #25Self-service

Solution Approach 2:

The patent replaces the mechanical fan-based active cooling system with a passive heat pipe system that uses thermodynamic phase change and natural convection. This substitution eliminates moving parts and power consumption while maintaining heat dissipation functionality through the integrated handle structure.

Inventive Principle:

Principle #28Mechanics substitution (Replace mechanical system)

3Volume of moving object

If the device is made more compact, then portability is improved, but thermal management becomes more challenging

Engineering Contradiction:

Improvedevice compactnessVSAvoidthermal management

Core Design Contradiction:

Volume of moving objectVSTemperature

Solution Approach 1:

The patent integrates the heat dissipation function directly into the handle structure by enclosing the heat pipe's cold end within the handle's internal cavity. This merging of structural and thermal management functions eliminates the need for separate cooling components, enabling effective heat dissipation in a compact form factor.

Inventive Principle:

Principle #5Merging (Combining)

Solution Approach 2:

The patent extends the heat pipe into the handle structure, utilizing the third dimension (depth of handle) to accommodate the heat dissipation pathway. The vented handle surface provides external heat rejection area, effectively using spatial dimensionality to manage thermal loads within compact constraints.

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution reduces power consumption and noise while providing efficient heat dissipation and ergonomic flexibility through passive cooling, allowing for effective thermal management in compact portable electronic devices.

Implementation Method 1

a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion

Methodology Applied

Scientific EffectHeat pipe: Heat Pipe

Implementation Method 2

Heat pipes are passive and may be used to transfer heat from a heat source to a heat sink with minimal temperature gradients

Methodology Applied

Scientific EffectPhase change: Phase Change

Implementation Method 3

the handle surface is vented to allow air flow across at least the heat dissipating portion

Methodology Applied

Scientific EffectConvection: Convection

Data Source

PatentUS7508662B2Handle arrangement with integrated heat pipe

Publication Date: 2009.03.24 APPLE INC

AI summary

Handle arrangements having an integrated heat pipe for use with a portable electronic device are presented including: a heat pipe, the heat pipe configured with a heat receiving portion, a heat conducting portion, and a heat dissipating portion; a handle disposed along an edge of the portable electronic device, the handle including a handle surface configured to enclose at least the heat dissipating portion, wherein the handle surface is vented to allow air flow across at least the heat dissipating portion; an attachment housing for attaching the handle with the portable electronic device, the attachment housing configured to enclose the heat conducting portion; and a processing unit having a contact surface, the contact surface in thermal communication with the heat receiving portion wherein the portable electronic device is configured to enclose the heat receiving portion.