Handle Substrate Transfer for Ultra-Thin Component Assembly
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Solution Overview
Problem
Conventional pick-and-place systems are ineffective for handling ultra-small or ultra-thin discrete components due to physical limitations and high production costs, leading to inefficiencies and low production rates.
Innovation Solution
The use of a handle substrate with a releasable thermal or UV-sensitive release layer to temporarily attach ultra-thin or ultra-small discrete components, allowing for their transfer and bonding to a device substrate using thermal or UV energy to control adhesion, and subsequent removal of the handle substrate without damaging the components.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Extent of automation
If conventional pick-and-place systems are used to handle ultra-small or ultra-thin discrete components, then automation is achieved, but physical limitations and high production costs make the system ineffective
Solution Approach 1:
A handle substrate is introduced as an intermediary carrier to temporarily hold ultra-small or ultra-thin discrete components. This handle substrate serves as a mediator between the manufacturing process and the final device substrate, enabling components that are too small or thin to be handled directly by conventional pick-and-place systems to be transferred and assembled effectively.
2Productivity
If conventional pick-and-place systems are used for ultra-small or ultra-thin components, then automated transfer is attempted, but production rates remain low
Solution Approach 1:
Discrete components are temporarily attached to the handle substrate in advance before the final assembly process. This preliminary action of pre-positioning components on the handle substrate enables more efficient automated transfer and assembly operations, thereby increasing production rates while maintaining automation.
3Adaptability or versatility
If a handle substrate is used to temporarily attach ultra-thin or ultra-small discrete components, then compatibility with standard electronics packaging equipment is achieved, but additional processing steps are required
Solution Approach 1:
The handle substrate incorporates a release layer with specific thermal or UV sensitivity parameters that change under controlled conditions. This parameter change enables the release layer to transition from an adhesive state to a non-adhesive state, allowing components to be released from the handle substrate without damaging them, thereby managing the additional processing complexity through controlled material property changes.
4Ease of operation
If thermal or UV energy is applied to control adhesion of the release layer, then component transfer and bonding are enabled, but energy consumption increases
Solution Approach 1:
Thermal or UV energy is applied in periodic or pulsed manner rather than continuously to control the adhesion of the release layer. This periodic application of energy enables component transfer and bonding operations while reducing overall energy consumption compared to continuous energy application.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables efficient packaging of ultra-thin and ultra-small components compatible with standard electronics packaging equipment, reducing production costs and expanding market accessibility for low-cost electronic devices.
Implementation Method 1
The thermal sensitivity of the second layer causes a decrease in an adhesive strength in response to an application of thermal energy
Implementation Method 2
The UV light sensitivity causes an increase in adhesive strength in response to an application of UV light or causes a decrease in adhesive strength in response to an application of UV light
Implementation Method 3
Bonding further includes delivering thermal energy or energy of UV light to both bond the discrete component with the substrate and release the discrete component from the handle
Implementation Method 4
Bonding further includes delivering thermal energy or energy of UV light to both bond the discrete component with the substrate and release the discrete component from the handle
Data Source
AI summary
Among other things a method including releasing a discrete component from an interim handle and depositing a discrete component on a handle substrate, attaching the handle substrate to the discrete component, and removing the handle substrate from the discrete component.