Handle-Substrate Anti-Adhesive Film for Temporary Bonding
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Solution Overview
Problem
Existing methods for temporary bonding of substrates in electronics and optoelectronics face challenges such as dewetting of adhesives on low-energy surfaces, making it difficult to achieve homogeneous adhesive deposition and subsequent bonding, especially when the substrate components are not compatible with annealing processes or have unfavorable topography.
Innovation Solution
A process involving the deposition of an anti-adhesive formulation on a support substrate, followed by the application of a liquid adhesive formulation before complete solvent evaporation, which forms a release film with a low bonding energy, allowing for dewetting-free adhesive deposition and subsequent evaporation to achieve the desired anti-adhesive properties without additional treatments like corona or UV treatment.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Strength
If a non-stick removal layer is present on the substrate-handle to ensure low adhesion, then the bonding energy between the non-stick layer and adhesive is reduced, but the adhesive deposition becomes difficult due to dewetting on the low-energy surface
Solution Approach 1:
The invention applies the adhesive formulation to the non-stick layer before the solvent completely evaporates, at a stage when the layer still has sufficient surface energy to wet the adhesive. This preliminary action allows homogeneous adhesive deposition while maintaining the final low bonding energy property after complete solvent removal
Solution Approach 2:
The invention exploits the dynamic change in surface energy parameters of the non-stick layer during solvent evaporation. By controlling the timing of adhesive application to coincide with the intermediate surface energy state, the process achieves both good wetting during deposition and low adhesion in the final state
2Manufacturing precision
If the adhesive is spread on the first plate by centrifugal coating followed by annealing, then homogeneous adhesive deposition is achieved, but the method becomes incompatible with substrates that cannot withstand annealing or have unfavorable topography
Solution Approach 1:
The invention extracts the adhesive application step from the annealing process by applying the adhesive to the non-stick layer before solvent evaporation is complete. This separates the adhesive deposition function from the thermal treatment, eliminating the need for annealing and expanding substrate compatibility
Solution Approach 2:
The non-stick layer acts as an intermediary substrate that can be prepared in advance with controlled surface properties. By applying adhesive to this intermediary surface before complete solvent removal, the method creates a compatible interface for diverse final substrates without requiring them to withstand the preparation process
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This method enables the deposition of adhesives without dewetting, resulting in a substrate-handle with a bonding energy of less than 1.2 J/m², facilitating temporary bonding and easy detachment while avoiding the need for additional surface treatments.
Implementation Method 1
evaporation of the first solvent so as to obtain a non-stick film from the film
Implementation Method 2
the surface of the release layer typically has very low surface energy, making it poorly wetting to the adhesive. Consequently, applying a liquid adhesive to this type of surface will result in dewping
Data Source
Figure 1~2
Figure 3
AI summary
A process for manufacturing a handle-substrate (100), the process comprising the steps of: a) supplying a support substrate (1) comprising a receiving face, b) forming a film (2) by depositing a non-stick formulation comprising a first solvent on the receiving face of the support substrate (1), c) depositing a liquid formulation on one face of the film (2), before the complete evaporation of the first solvent, the liquid formulation being intended to form an adhesive layer (3), and having a surface energy of γl(liquid), and d) evaporating the first solvent so as to obtain a non-stick film (4) from the film (2) in order to obtain the handle-substrate (100), the non-stick film (4) making it possible to obtain a sufficiently low bonding energy with the adhesive layer: <1.2J/m2.