Robotic Handler Alignment for Semiconductor Film Frame Transfer
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Solution Overview
Problem
Existing semiconductor component handling and inspection systems are complex and costly due to the need for multiple ejector pins and alignment mechanisms, which increase manufacturing complexity and reduce suction uniformity, and often result in damage to film frames during handling.
Innovation Solution
A system utilizing multiple robotic film frame handlers with end effectors and registration elements that spatially align film frames externally before transfer to a vacuum table, eliminating the need for ejector pins and reducing alignment complexity by using a pick and place mechanism with suction elements for precise handling and transfer.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If multiple ejector pins and alignment mechanisms are used in the vacuum table, then spatial alignment of film frames can be achieved, but device complexity and manufacturing cost increase
Solution Approach 1:
The patent removes the alignment mechanisms and ejector pins from the vacuum table structure entirely. Instead, alignment is performed externally by the robotic handler using registration elements that engage with features on the film frame itself, extracting the alignment function from the vacuum table and placing it in the transfer mechanism.
Solution Approach 2:
The robotic handler performs spatial alignment of the film frame before the frame is placed on the vacuum table. The registration elements engage with registration features on the film frame during the transfer operation, accomplishing alignment in advance of the inspection process and eliminating the need for alignment mechanisms during vacuum table operation.
2Ease of operation
If multiple ejector pins are used to receive and align film frames, then film frames can be handled and aligned, but suction uniformity across the vacuum table surface is reduced
Solution Approach 1:
The patent removes ejector pins from the vacuum table structure entirely, eliminating the gaps and openings they create. This allows the vacuum table surface to maintain uniform suction characteristics across its entire area, while the handling function is transferred to the robotic handler with its suction elements.
3Productivity
If ejector pins are extended to lift film frames for removal, then film frames can be transferred, but damage to film frames may occur
Solution Approach 1:
The patent replaces the mechanical ejector pin system with a suction-based holding system. The robotic handler uses suction elements to hold and transfer film frames without mechanical contact that could cause damage. The film frame is held by atmospheric pressure differential rather than mechanical protrusion, eliminating the harmful mechanical interaction.
4Manufacturing precision
If alignment elements and sensors are carried by the vacuum table, then spatial alignment can be facilitated, but manufacturing cost and complexity increase
Solution Approach 1:
The patent removes alignment elements and sensors from the vacuum table structure. Instead, the robotic handler carries registration elements and sensing capabilities to perform alignment externally during the film frame transfer operation, eliminating the need for these components in the vacuum table itself.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach simplifies the handling and inspection process, reduces manufacturing costs, and minimizes damage to film frames by ensuring precise alignment and efficient transfer without ejector pins, enhancing throughput and alignment accuracy.
Implementation Method 1
a vacuum table or chuck... before images of the semiconductor components are captured
Data Source
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AI summary
A system and method for transferring component panes (e.g., film frames) from a component pane storage station to a vacuum table assembly. The system includes a number of component pane handlers, for instance two component pane handlers, and a pick and place mechanism or arm. The component pane handler transfers the component panes from the storage station to the pick and place mechanism. The system includes an alignment module or structure configured to facilitate or effectuate spatial alignment of the component pane while the component pane is coupled to or carried by the component pane handler. The alignment module can be carried by the pick and place mechanism. Spatial alignment of the component pane can be substantially completed before transfer of the component pane from the component pane handler to the pick and place mechanism. The pick and place mechanism includes a set of vacuum (or suction) elements or pads that enables pick up of the component pane from the component pane handler as well as release and pick up of the component pane at the vacuum table assembly.