Haptic Touch Module Assembly for Serviceable Mobile Touchpads
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Solution Overview
Problem
Implementing a haptic touchpad in an efficient manner while ensuring serviceability remains a challenge, particularly in mobile devices, where existing solutions do not adequately balance production efficiency, quality, and ease of maintenance.
Innovation Solution
A haptic touch module design comprising a bottom plate with recesses, a haptic sensor, a capacitive sensor printed circuit board assembly, and an overlay, with integrated electronics and adhesive systems, allowing for reliable attachment and efficient space utilization, and featuring through holes and cavities to facilitate piezo element bending and component routing.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If a haptic touchpad is implemented as an integrated component in mobile devices, then production efficiency is improved, but serviceability and ease of repair deteriorate
Solution Approach 1:
The haptic touchpad assembly is segmented into distinct functional components: the overlay layer, capacitive sensor layer, haptic actuator layer, and support structure. This segmentation allows each component to be manufactured separately and assembled into a modular unit that can be efficiently produced at scale while maintaining serviceability, as individual components can be replaced or repaired without replacing the entire assembly
2Volume of moving object
If multiple sensor and haptic components are integrated into a single module, then space utilization is improved, but device complexity increases
Solution Approach 1:
Multiple functional components (capacitive sensor, haptic actuator, support structures) are merged into a single integrated haptic touchpad assembly that occupies optimized space within the mobile device. The components are combined through layered construction where each layer serves multiple functions, reducing the overall volume required while managing complexity through standardized interfaces and assembly procedures
3Power
If piezo elements are designed with maximum bending capability, then haptic feedback performance is improved, but structural integrity and reliability deteriorate
Solution Approach 1:
The piezo elements are designed with non-uniform thickness distribution, featuring thicker regions at the edges and mounting points for structural support, and thinner regions in the center for maximum bending capability. This local variation in quality allows the piezo elements to achieve high haptic feedback performance where needed while maintaining structural integrity and reliability at critical stress points
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This design enhances production efficiency, quality, and serviceability by providing a modular and reliable haptic touch module that effectively attaches components, optimizes space, and ensures proper haptic feedback without compromising the structural integrity of the device.
Implementation Method 1
a piezoelectric element can be used both to sense a pressing force applied by the user and to generate the haptic feedback. The first-mentioned involves sensing a voltage that the piezoelectric element generates in response to mechanical deformation, and the latter involves applying a voltage waveform to the piezoelectric element that temporarily deforms it mechanically
Data Source
Figure 1A~1B
Figure 1C~1D
Figure 1E~1F
AI summary
A haptic touch module (124, 170) comprises a bottom plate (100, 140) comprising a recess (102, 172); a haptic sensor (104, 152) mounted in the recess (102, 172); a capacitive sensor printed circuit board assembly (106, 160) mounted on the haptic sensor (104, 152); and an overlay (108, 164) mounted on the capacitive sensor printed circuit board assembly (106, 160), the overlay (108, 164) having a length and width covering the bottom plate (100, 140).