Haptic Touch Module Assembly for Serviceable Piezo Feedback
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Solution Overview
Problem
The challenge in implementing a haptic touchpad in devices efficiently while ensuring serviceability and effective haptic feedback generation.
Innovation Solution
A haptic touch module comprising a bottom plate with recesses, a haptic sensor, a capacitive sensor printed circuit board assembly, and an overlay, with adhesive connections and integrated electronics, allowing for reliable attachment and efficient space utilization.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If piezoelectric elements are used to generate haptic effects and sense pressing force, then haptic feedback functionality is achieved, but the integration complexity and serviceability become challenging
Solution Approach 1:
The patent divides the touchpad system into separate functional modules: a haptic sensor module containing piezoelectric elements for haptic feedback, and a capacitive sensor module for touch detection. This segmentation allows independent optimization and simplification of each module's design and integration, reducing overall system complexity while maintaining full functionality.
2Reliability
If piezoelectric elements are used to generate haptic effects, then haptic feedback is provided, but serviceability and production efficiency are reduced
Solution Approach 1:
The haptic sensor module is pre-assembled with the piezoelectric elements and bonding structures fabricated in advance as a complete functional unit. This preliminary assembly allows the module to be produced, tested, and optimized independently before final integration into the touchpad, significantly improving production efficiency and serviceability while ensuring reliable haptic feedback generation.
3Reliability
If piezoelectric elements are used for haptic feedback, then tactile sensation is generated, but the structural design becomes more complex
Solution Approach 1:
The patent implements a nested structure where the haptic sensor module with piezoelectric elements is integrated within the overall touchpad assembly. The piezoelectric elements are positioned in recesses of the bottom plate, and the overlay is bonded directly to the structure, creating a compact nested arrangement that simplifies the overall structural design while maintaining effective haptic feedback transmission.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
Enables improved production process, quality, and serviceability of the haptic touch module by providing a seamless and efficient assembly solution.
Implementation Method 1
a piezoelectric element can be used both to sense a pressing force applied by the user and to generate the haptic feedback. The latter involves applying a voltage waveform to the piezoelectric element that temporarily deforms it mechanically
Implementation Method 2
The first-mentioned involves sensing a voltage that the piezoelectric element generates in response to mechanical deformation
Data Source
AI summary
A haptic touch module (124, 170) comprises a bottom plate (100, 140) comprising a recess (102, 172); a haptic sensor (104, 152) mounted in the recess (102, 172); a capacitive sensor printed circuit board assembly (106, 160) mounted on the haptic sensor (104, 152); and an overlay (108, 164) mounted on the capacitive sensor printed circuit board assembly (106, 160), the overlay (108, 164) having a length and width covering the bottom plate (100, 140).