Haptic Feedback Wire Mount for Input Device

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Solution Overview

Problem

Existing input devices, such as proximity sensor devices, face challenges in providing effective haptic feedback and precise positional information due to limitations in substrate displacement control and sensor integration, which affects usability and accuracy.

Innovation Solution

The input device incorporates a moveable substrate coupled with a haptic actuator and wire elements, featuring wire alignment and capturing features to control displacement within specific planes, allowing for precise haptic feedback and improved positional information detection through sensor electrodes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If a haptic actuator is used to displace the substrate, then haptic feedback capability is improved, but control precision of substrate displacement is worsened

Engineering Contradiction:
Improvehaptic feedback capabilityVSAvoidsubstrate displacement control precision
Core Design Contradiction:
Ease of manufactureVSManufacturing precision

Solution Approach 1:

The wire element is configured with different properties in different regions: it has flexibility to allow substrate displacement in the first direction (parallel to input surface), but maintains rigidity to prevent displacement in the second direction (perpendicular to input surface). This local differentiation of mechanical properties enables precise control of substrate movement while maintaining haptic feedback capability.

Inventive Principle:
Principle #3Local quality

Solution Approach 2:

The wire element transitions from a static support structure to a dynamic constraint that adaptively guides substrate movement. The wire's elastic properties allow it to flex in the desired direction of motion while automatically resisting movement in perpendicular directions, providing dynamic control without complex mechanisms.

Inventive Principle:
Principle #15Dynamics

2Manufacturing precision

If wire alignment features are added to control displacement, then substrate displacement control is improved, but device complexity is worsened

Engineering Contradiction:
Improvesubstrate displacement controlVSAvoiddevice structure complexity
Core Design Contradiction:
Manufacturing precisionVSDevice complexity

Solution Approach 1:

The wire alignment features are integrated directly into the substrate structure, combining the wire element's mechanical properties with the substrate's geometric features. This merging eliminates the need for separate alignment mechanisms while maintaining precise control over substrate displacement in both directions.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The wire element serves multiple functions simultaneously: it provides mechanical support for the substrate, enables controlled displacement in the first direction, prevents displacement in the second direction, and works in conjunction with sensor electrodes to enable haptic feedback. This multi-functionality reduces the need for additional components.

Inventive Principle:
Principle #6Universality (Multi-functionality)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This configuration enhances usability by providing accurate haptic feedback and precise positional information, improving the overall interaction experience by ensuring controlled substrate displacement and effective sensor integration.

Implementation Method 1

The wire element returns the moveable substrate to an original position

Methodology Applied
Scientific EffectElasticity: Elasticity

Data Source

PatentUS10162418B2Haptic feedback wire mount
Publication Date: 2018.12.25 SYNAPTICS INC
  • US10162418B2 patent drawing
  • US10162418B2 patent drawing
  • US10162418B2 patent drawing

AI summary

An input device may include a wire element and a moveable substrate coupled to the wire element. The moveable substrate may include various wire alignment features. The input device may further include an input surface disposed above the moveable substrate. The input device may further include various sensor electrodes coupled to the input surface. The input device may further include a haptic actuator coupled to the moveable substrate. The haptic actuator may displace the moveable substrate in a direction substantially parallel to a plane of the input surface. The wire element may return the moveable substrate to an original position. The wire alignment features may allow, in response to an applied force by the haptic actuator and to the moveable substrate, a displacement of the moveable substrate in the direction that is substantially parallel to the plane of the input surface.