Hard-Brittle Substrate Cutting with Protective Films
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Solution Overview
Problem
Current methods for cutting out hard-brittle substrates like glass, quartz, and ceramics face challenges in precision and damage prevention during the cutting process, particularly with techniques like laser scribing and blasting, which struggle with high-precision control and edge damage.
Innovation Solution
A method involving the use of blast-resistant protective films on both surfaces of the substrate, with controlled abrasive blasting from both sides to minimize damage and achieve precise cutting, utilizing specific abrasive properties and ejection conditions to maintain accuracy and reduce edge chipping.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Ease of manufacture
If laser scribing is used to cut hard-brittle substrates, then non-contact processing and prevention of contamination are improved, but high-precision control of breaking direction and end face precision deteriorate
Solution Approach 1:
The cutting process is divided into two separate stages: scribing (creating initial cracks) and breaking (separating the substrate). This segmentation allows each stage to be optimized independently - laser scribing for non-contact precision marking and mechanical breaking for controlled separation, resolving the contradiction between non-contact processing ease and breaking precision.
Solution Approach 2:
The patent introduces an intermediary support structure (sacrificial layer or support substrate) that facilitates precise breaking control. This intermediary element provides a controlled interface for applying breaking forces, enabling high-precision control of breaking direction while maintaining the advantages of laser scribing for the initial cut.
2Manufacturing precision
If full cut laser scribing is used to eliminate breaking process, then breaking precision control is improved, but processing time and energy consumption increase
Solution Approach 1:
Instead of performing a complete full-cut through the entire thickness, the patent uses partial scribing that creates sufficient initial cracks to guide the breaking process. This partial action approach achieves the necessary precision for end face quality while significantly reducing processing time and energy consumption compared to complete full-cut laser scribing through the entire substrate.
3Productivity
If abrasive blasting is used to cut substrates, then cutting speed is improved, but edge chipping and cracks in margin increase
Solution Approach 1:
The patent applies preliminary protective coating to the substrate edges and margins before abrasive blasting. This preliminary action creates a protective barrier that prevents edge chipping and cracks during the high-speed blasting process, allowing the use of aggressive blasting parameters for high productivity while protecting vulnerable areas from damage.
Solution Approach 2:
The patent applies different protective measures to different regions of the substrate - full protection on edges and margins versus controlled blasting on the cutting regions. This local differentiation allows high-speed blasting where needed while preventing chipping in critical areas, resolving the contradiction between cutting speed and edge quality.
4Reliability
If protective films are applied to prevent damage, then reliability is improved, but device complexity and processing time increase
Solution Approach 1:
The protective film application is integrated into the periodic workflow of the cutting process, applied only when and where needed (before blasting operations) rather than continuously. This periodic application maintains reliability for damage prevention while minimizing the addition of processing steps and device complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This approach enables precise cutting of hard-brittle substrates without cracking or chipping, allowing for reliable production of substrates with minimal damage to the material and reduced need for post-processing polishing, while maintaining high accuracy and productivity.
Implementation Method 1
forming first protective films (4) with blast-resistant property... and second protective films (5) with blast-resistant property
Implementation Method 2
cutting the cutting regions (6) from either one surface of the plate material (1)... then cutting the cutting region (6) from the other surface
Data Source
AI summary
To cut out a hard-brittle substrate by blasting, laying out substrates 2 on a plate material 1 made of a hard-brittle material with leaving a space for blasting; forming first protective films 4 on both surfaces of the plate material 1 at layout positions of the substrates 2; and forming second protective films 5 on both surfaces of a margin 3 of the plate material 1 with leaving a space with respect to the first protective films 4 and having outer edges from a periphery of the plate material 1 at a width of 5 mm or less; cutting regions 6 between the films 4, 4 and between the films 4, 5 from one surface of the plate material 1 to a depth of approximately half of a thickness thereof by blasting, then cutting from the other surface of the plate material 1 until the plate material 1 is penetrated.