Hard-Coated Mold Resin Lamination Without Mold Contamination

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Solution Overview

Problem

Existing methods for producing hard coating layer-laminated mold resins often result in contamination of molding tools due to the adherence of adhesive layers, either during the transfer process or when using jigs, which compromises the adhesion of the hard coating layer to the mold resin.

Innovation Solution

A method involving a multi-layered sheet with a protective layer made of active energy ray-curable resin, containing a thermally reactive group and a polysiloxane chain, is used. This protective layer is exposed and chemically bonds with the thermally uncured or half-cured mold resin, eliminating the need for an adhesive layer and preventing tool contamination.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Strength

If an adhesive layer is used to laminate the hard coating layer on the mold resin, then the adhesion between the hard coating layer and mold resin is improved, but the adhesive layer adheres to and contaminates the mold

Engineering Contradiction:
Improveadhesion between hard coating layer and mold resinVSAvoidcontamination of mold
Core Design Contradiction:
StrengthVSObject-generated harmful factors

Solution Approach 1:

The invention extracts and removes the adhesive layer from the transfer material structure. By eliminating the adhesive layer entirely and replacing it with a protective layer that directly bonds to the mold resin, the source of mold contamination is removed while adhesion is maintained through the bonding capability of the protective layer

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The invention changes the chemical and physical parameters of the protective layer by incorporating thermally reactive groups that can chemically bond with the mold resin. This parameter change enables the protective layer to function as both a protective barrier and an adhesive interface, eliminating the need for a separate adhesive layer

Inventive Principle:
Principle #35Parameter changes

2Object-generated harmful factors

If the adhesive layer is omitted to prevent mold contamination, then the contamination of mold is suppressed, but the hard coating layer cannot adhere to the resin article

Engineering Contradiction:
Improvecontamination of moldVSAvoidadhesion between hard coating layer and mold resin
Core Design Contradiction:
Object-generated harmful factorsVSStrength

Solution Approach 1:

The protective layer is modified by incorporating thermally reactive groups that enable chemical bonding with the mold resin. This parameter change transforms the protective layer from a simple barrier into an active bonding interface that can adhere to the mold resin without requiring a separate adhesive layer

Inventive Principle:
Principle #35Parameter changes

Solution Approach 2:

The protective layer is designed to perform multiple functions simultaneously: it protects the mold resin surface, provides thermal reactivity for bonding, and eliminates the need for a separate adhesive layer. This multi-functionality resolves the contradiction by making the protective layer sufficient for both protection and adhesion

Inventive Principle:
Principle #6Universality (Multi-functionality)

3Ease of manufacture

If the transfer material is disposed in the mold with the adhesive layer exposed, then the hard coating layer can be transferred to the mold resin, but the adhesive layer adheres to and contaminates the mold

Engineering Contradiction:
Improvetransfer processVSAvoidcontamination of mold
Core Design Contradiction:
Ease of manufactureVSObject-generated harmful factors

Solution Approach 1:

The adhesive layer is extracted and removed from the transfer material structure. The protective layer is reconfigured to be the exposed top layer that directly contacts and bonds with the mold resin, eliminating the adhesive layer that causes contamination while maintaining the transfer capability

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

Instead of having the adhesive layer as the exposed top layer for transfer, the invention inverts the structure by making the protective layer the exposed top layer. This inversion allows the protective layer to directly bond with the mold resin through its thermally reactive groups, eliminating the need for an adhesive layer

Inventive Principle:
Principle #13The other way round (Inversion)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The method effectively adheres the hard coating layer to the mold resin without using an adhesive, while preventing contamination of molding tools, ensuring excellent adhesion and reducing production costs.

Implementation Method 1

the protective layer including a product of an active energy ray-curable resin cured or half-cured by active energy ray

Methodology Applied
Scientific EffectActive energy ray curing: Photopolymerisation

Implementation Method 2

the thermally reactive group being capable of reacting and thermally curing with the mold resin in a thermally uncured and/or half-cured state

Methodology Applied
Scientific EffectThermal curing reaction: Chemical Bonding

Implementation Method 3

a transfer step of bringing into contact and heating the thermally uncured and/or half-cured mold resin and the protective layer

Methodology Applied
Scientific EffectThermal heating: Heating

Data Source

PatentEP3892437B1Hard coating layer-laminated mold resin and method for producing same
Publication Date: 2023.08.23 HARIMA CHEM INC
  • EP3892437B1 patent drawingFigure 1~2
  • EP3892437B1 patent drawingFigure 3A~3D
  • EP3892437B1 patent drawingFigure 4

AI summary

A method of producing a hard coating layer-laminated mold resin comprising a transfer material preparation step, a resin preparation step, a disposition step, and a transfer step. In the transfer material preparation step, a transfer material including a substrate sheet and a protective layer is prepared. The protective layer includes a cured and/or half-cured product of an active energy ray-curable resin and has a thermally reactive group and a polysiloxane chain. In the resin preparation step, mold resin in a thermally uncured and/or half-cured state is prepared. In the disposition step, the transfer material is disposed so that the protective layer is exposed. In the transfer step, the mold resin and the protective layer are brought into contact and heated to chemically bond them, and the mold layer is cured, and the protective layer is cured to form the hard coating layer.