Hard Part Spacer for Bonding Electrode Alignment in Electronic Devices
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Solution Overview
Problem
The existing methods for manufacturing electronic devices with bonded structure bodies face challenges in achieving high yield due to defects such as open and short defects during the bonding process, particularly due to misalignment and deformation of bonding electrodes under stress, leading to incomplete bonding and reduced yield.
Innovation Solution
Incorporating a hard part with higher hardness than the bonding electrodes between the structure bodies, which acts as a spacer to regulate the distance and improve adhesion, and forming protruding parts on the bonding electrodes to reduce contact area and increase pressure, thereby enhancing the bonding process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If bonding electrodes are bonded directly without additional structures, then the manufacturing process is simple, but misalignment and deformation occur under stress leading to open and short defects
Solution Approach 1:
A hard part is introduced as an intermediary component between the first base body and the second base body. This hard part includes a first protruding part that contacts the first bonding electrode and a second protruding part that contacts the second bonding electrode, serving as a mediator to regulate distance and suppress deformation during bonding.
Solution Approach 2:
The hard part is prepared in advance with specific protruding parts designed to contact the bonding electrodes. This preliminary preparation ensures that when bonding occurs, the distance between base bodies is already regulated and the bonding electrodes are protected from deformation.
2Strength
If pressure is increased to improve bonding adhesion, then bonding strength improves, but bonding electrode deformation increases causing misalignment
Solution Approach 1:
The hard part acts as a mechanical intermediary that distributes and regulates the bonding pressure. The protruding parts of the hard part contact the bonding electrodes, preventing direct compression deformation while allowing sufficient pressure for strong adhesion.
Solution Approach 2:
The hardness parameter of the hard part is specifically designed to be higher than that of the bonding electrodes. This parameter change allows the hard part to resist deformation under pressure while protecting the softer bonding electrodes from deformation.
3Productivity
If the distance between base bodies is reduced to improve bonding, then bonding efficiency improves, but misalignment defects increase
Solution Approach 1:
The hard part is pre-configured with protruding parts that establish the correct distance between base bodies before bonding occurs. This preliminary distance regulation prevents misalignment while allowing efficient bonding at the regulated distance.
Solution Approach 2:
The hard part serves as a distance-regulating intermediary between the base bodies. The protruding parts physically limit how close the base bodies can come, ensuring proper alignment while still allowing sufficient proximity for effective bonding.
Data Source
AI summary
An electronic device includes a first structure body and a second structure body. The first structure body includes a first base body, a first bonding electrode and a first hard part. The second structure body includes a second base body, and a second bonding electrode. The first bonding electrode and the second bonding electrode are bonded to each other between the first base body and the second base body. The first hard part is located between the first base body and the second base body. The first hard part is positioned within an area in which the first bonding electrode is located when viewed along a first direction. The first direction is from the first base body toward the first bonding electrode. The first hard part has a higher hardness than the first bonding electrode.