Deployable Hardened Chassis With Passive Cooling for Harsh Environments
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Solution Overview
Problem
Existing computing and radio-based devices face challenges in being deployed in harsh, dynamic, and space-, weight-, and power-constrained environments, such as on vehicles or maritime vessels, where they are prone to damage and overheating, and require efficient cooling without the need for fans or additional electronics.
Innovation Solution
The development of a ruggedized chassis system with shock mounts, heat pipes, and heat sinks that combine thermal conductivity and phase transitions to dissipate heat, allowing for efficient deployment and operation in severe conditions, reducing size, weight, and power requirements, and incorporating flexible mounting options and versatile power systems.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If traditional computing and radio-based devices are deployed in harsh environments, then they can perform detection and mitigation functions, but they are prone to damage and overheating
Solution Approach 1:
The patent incorporates shock mounts and protective protrusions into the chassis design before deployment. The shock mounts are positioned to absorb impact forces during transport and operation in harsh environments, while protective protrusions extend beyond the housing to prevent direct contact with damaging elements. This beforehand cushioning approach prepares the device to withstand environmental stresses before they occur.
Solution Approach 2:
The patent converts the harmful thermal energy generated by electronic components into a manageable parameter by implementing heat pipes and heat sinks. The heat pipes conduct and transfer the waste heat away from sensitive components, while the heat sinks dissipate it into the environment. This transforms the harmful overheating effect into a controlled thermal management system that maintains device reliability.
2Temperature
If fans and additional electronics are added for cooling, then overheating can be prevented, but size, weight, and power requirements increase
Solution Approach 1:
The patent replaces active mechanical cooling systems (fans) with passive thermal management components. Heat pipes utilize phase change and capillary action to transport heat without mechanical movement, while heat sinks rely on natural convection and radiation. This substitution eliminates the need for motors, power consumption, and additional control electronics, significantly reducing weight and power requirements while maintaining effective heat dissipation.
Solution Approach 2:
The patent employs heat pipes that utilize phase transitions of working fluid (evaporation and condensation) to transfer heat efficiently. The phase change mechanism allows large amounts of thermal energy to be transported through the heat pipe without requiring external power or moving parts, providing high heat dissipation capability with minimal weight and power overhead.
3Strength
If robust protective features are added to the chassis, then device durability improves, but device complexity increases
Solution Approach 1:
The patent merges multiple protective functions into integrated chassis components. The shock mounts are incorporated directly into the chassis frame structure, eliminating the need for separate mounting brackets or additional protective housings. The protective protrusions are formed as integral parts of the chassis corners, providing impact protection without requiring separate attachment components. This merging approach maintains high strength and protection capability while minimizing structural complexity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enables robust, adaptable, and deployable computing and radio systems that can detect, identify, and mitigate small unmanned aerial vehicle threats, operating effectively in extreme temperatures, humidity, and vibrations, while reducing size, weight, and power consumption, and providing real-time situational awareness.
Implementation Method 1
heat pipes, which can combine thermal conductivity and phase transitions to release heat produced by processors
Implementation Method 2
heat pipes, which can combine thermal conductivity and phase transitions to release heat produced by processors
Implementation Method 3
one or more heat sinks, with or without thermal communication to any heat pipes
Implementation Method 4
The heat sinks can be integral and/or monolithic components of the panels and/or plates of the system
Data Source
AI summary
The present application describes apparatuses, systems, and methods for robust, adaptable, and deployable computing devices and radio systems. In one aspect, the present application describes a chassis for housing electronic componentry. The chassis includes a frame with a top plate and a bottom plate, an interface panel located on the chassis frame; a back panel located on the chassis frame opposite the interface panel, and a protective protrusion located at a corner of the chassis frame extending beyond the top plate and the bottom plate.