Hardened Optical Platform Thermal Management via Intertwined Fins

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Solution Overview

Problem

Existing hardened optical platforms for outdoor deployments face challenges in heat dissipation due to temperature variations, lack of airflow, and power consumption constraints, which affect component reliability and functionality.

Innovation Solution

A hardened optical platform design featuring a base chassis and lid with fins, a vapor chamber connected to a heat exchanger, and low-power dual rotor fans that force air through a duct formed by intertwined vapor chamber and base fins, facilitating heat transfer by convection.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Reliability

If the optical platform is hardened and sealed for outdoor deployment, then protection from environmental factors is improved, but heat dissipation capability deteriorates

Engineering Contradiction:
Improveprotection from environmental factorsVSAvoidheat dissipation capability
Core Design Contradiction:
ReliabilityVSTemperature

Solution Approach 1:

The optical platform is divided into separate functional zones: a sealed hardened enclosure for optical components and a dedicated heatsink assembly with fins for thermal management. The heatsink is attached to the enclosure exterior, creating a thermal pathway that bypasses the sealed barrier while maintaining environmental protection inside.

Inventive Principle:
Principle #1Segmentation

Solution Approach 2:

A heatsink assembly acts as an intermediary thermal management component between the internal optical components and the external environment. The heatsink absorbs heat from the sealed enclosure through thermal contact and dissipates it to ambient air via its finned structure, mediating the thermal transfer without compromising the sealed enclosure's environmental protection.

Inventive Principle:
Principle #24Intermediary (Mediator)

2Object-affected harmful factors

If the enclosure is sealed without vents, then protection from moisture and UV radiation is improved, but heat discharge capability deteriorates

Engineering Contradiction:
Improveprotection from moisture ingressVSAvoidheat discharge capability
Core Design Contradiction:
Object-affected harmful factorsVSLoss of energy

Solution Approach 1:

The thermal management function is extracted from the sealed enclosure by attaching an external heatsink assembly to the enclosure exterior. This separates the environmental protection function (maintained by the sealed enclosure) from the heat dissipation function (performed by the external heatsink), allowing the enclosure to remain fully sealed while effectively discharging heat.

Inventive Principle:
Principle #2Taking out (Extraction)

3Volume of moving object

If the form factor is minimized for remote deployment, then ease of installation is improved, but heat dissipation surface area deteriorates

Engineering Contradiction:
Improveform factor sizeVSAvoidheat dissipation surface area
Core Design Contradiction:
Volume of moving objectVSTemperature

Solution Approach 1:

The heatsink assembly extends the thermal dissipation surface area into the external dimension by attaching fins to the enclosure exterior. This vertical/three-dimensional expansion of the heatsink structure provides adequate heat dissipation surface area without increasing the horizontal footprint or internal volume of the optical platform, maintaining a compact form factor suitable for remote deployment.

Inventive Principle:
Principle #17Another dimension (Dimensionality change)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The design effectively dissipates heat across a wide temperature range (-40° C to +60° C) without the need for thermoelectric cooling modules, maintaining optimal component temperatures and improving reliability and functionality.

Implementation Method 1

heat must be conducted to the housing by means of a heat sink, heat pipe, or vapor chamber

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

one or more fans located adjacent to the heat exchanger to provide airflow through the interior

Methodology Applied
Scientific EffectConvection: Convection

Implementation Method 3

one or more fans to provide airflow through the interior. The airflow can be over the intertwined second plurality of fins and third plurality of fins

Methodology Applied
Scientific EffectForced convection: Forced Convection

Implementation Method 4

The heat exchanger can include a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior. The airflow can be over the intertwined second plurality of fins and third plurality of fins

Methodology Applied
Scientific EffectConvection: Convection

Data Source

PatentUS12238851B2Hardened optical platform including high-power electro-optics and heat dissipating circuitry and associated thermal solution
Publication Date: 2025.02.25 CIENA CORP
  • US12238851B2 patent drawing
  • US12238851B2 patent drawing
  • US12238851B2 patent drawing

AI summary

The present disclosure relates to a thermal solution using a heat exchanger mounted inside an outdoor telecom unit. More specifically, a hardened optical platform includes a base chassis and a lid configured to seal an interior of the base chassis, wherein each of the base chassis and the lid include a plurality of fins. The hardened optical platform also including a vapor chamber in the interior including a heat exchanger. The heat exchanger including a second plurality of fins that are intertwined with a third plurality of fins on the base chassis in the interior.