Hardwired Switch TSV Reconfiguration for Signal Flexibility
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Solution Overview
Problem
Current die stack technologies have fixed signal transmission modes, requiring changes to micro bumps or wires in the redistribution layer to accommodate different signal designs, which is inefficient and limits flexibility.
Innovation Solution
The method involves configuring through silicon vias (TSVs) between landing pads on different dies to create various signal transmission modes without altering the positions of bond pads or conductive bumps, allowing for dynamic reconfiguration of signal paths.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Adaptability or versatility
If signal transmission modes are changed to accommodate different signal designs, then adaptability is improved, but device complexity increases due to requiring changes in micro bumps or wires configuration
Solution Approach 1:
The patent changes the configuration parameters of through-silicon vias (TSVs) to achieve different signal transmission modes. By varying TSV positions, connections, and routing paths within the die stack, multiple signal transmission configurations are enabled without changing the fundamental die structure, bond pad positions, or conductive bumps. This parameter-based reconfiguration provides adaptability while maintaining structural simplicity.
2Adaptability or versatility
If micro bumps or wires in redistribution layer are changed to satisfy different signal requirements, then adaptability is improved, but manufacturing complexity increases
Solution Approach 1:
The patent performs preliminary configuration of through-silicon vias (TSVs) during die fabrication, establishing multiple potential signal paths in advance. The TSVs are pre-positioned and pre-connected within the die structure before stacking, allowing post-manufacturing reconfiguration of signal transmission modes by simply changing which pre-configured TSVs are activated or connected. This eliminates the need for complex post-manufacturing modifications to micro bumps or wires.
3Adaptability or versatility
If signal transmission paths are reconfigured to achieve different designs, then design flexibility is improved, but production time increases due to requiring structural changes
Solution Approach 1:
The patent implements dynamic reconfigurability in the die stack by incorporating controllable switches or routing mechanisms at the TSV level. This allows signal transmission paths to be dynamically changed through electrical control or configuration commands rather than physical structural modifications. The dynamic nature of the reconfiguration enables rapid switching between different signal transmission modes without time-consuming manufacturing changes.
Data Source
AI summary
An operating method of a hardwired switch is provided. First, a first die is provided. The first die is configured as the first die in the hardwired switch. Next, a function of the first die is inspected to obtain an inspected result. Upon the inspected result, whether a second TSV is selectively disposed between the first landing pad and the fifth landing pad, between the second landing pad and the sixth landing pad, between the third landing pad and the seventh landing pad, or between the fourth landing pad and the eighth landing pad or not is determined. The first die is stacked above a second die, so that the second surface is located between the first die and the second die.