Hash Assembly Heat Spreader Layout for Uniform Chip Cooling
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Solution Overview
Problem
Conventional hash board heat dissipation solutions result in significant temperature differences among chips due to uneven heat distribution, leading to reduced service life and increased fault rates.
Innovation Solution
A hash assembly with a heat dissipation assembly comprising a heat sink, base plate, and heat spreaders arranged to match chip columns, where chips are densely packed near the air inlet and sparsely packed near the air outlet, with heat spreaders embedded in the base plate to balance temperature uniformity.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If chips are densely packed on the hash board to increase computing power, then productivity is improved, but temperature uniformity deteriorates due to uneven heat distribution
Solution Approach 1:
The patent applies local quality by varying chip density across different regions of the hash board. Chips are arranged in columns with different densities: higher density near the air inlet where cooling is more effective, and lower density near the air outlet where cooling is less effective. This non-uniform distribution compensates for the uneven heat dissipation capabilities across the board, maintaining temperature uniformity while maximizing overall computing power.
Solution Approach 2:
The patent changes the parameter of chip density distribution from uniform to non-uniform. By adjusting the density parameter spatially across the hash board, the system optimizes both productivity and temperature uniformity. The density parameter varies along the air flow direction, creating regions with different chip concentrations that match the local heat dissipation capacity.
2Temperature
If a dedicated heat sink is added to cool the hash board, then temperature is reduced, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing hash board structure by integrating heat sinks directly onto the board. Rather than adding separate, complex cooling systems, the heat sinks are combined with the chip mounting structure, creating a unified assembly that cools multiple chips simultaneously while minimizing additional complexity.
Solution Approach 2:
The heat sink structure serves multiple functions: it provides thermal management for chips, acts as a structural support element, and facilitates air flow distribution across the hash board. This multi-functionality reduces the need for additional dedicated cooling components, thereby limiting the increase in device complexity.
3Ease of manufacture
If uniform chip density is maintained across the hash board, then ease of manufacture is improved, but temperature uniformity deteriorates due to uneven heat distribution along air flow path
Solution Approach 1:
The patent implements local quality by creating regions with different chip densities based on their location relative to the air inlet and outlet. Instead of uniform density, each region is optimized for its local thermal conditions, with higher density where cooling is stronger and lower density where cooling is weaker. This approach prioritizes temperature uniformity over manufacturing simplicity.
Solution Approach 2:
The patent introduces asymmetry in chip distribution along the air flow direction. The chip density is deliberately made asymmetric, with denser packing near the inlet and sparser packing near the outlet. This asymmetric arrangement compensates for the asymmetric heat dissipation characteristics of the air flow path, achieving better temperature uniformity.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution achieves better temperature uniformity across chips by effectively distributing heat, reducing temperature differences and enhancing the service life and reliability of the hash board.
Implementation Method 1
the heat spreaders are embedded in the base plate... the first heat sink is in direct contact with the first surface, and the hash board is in direct contact with the second surface
Implementation Method 2
a heat dissipation assembly fixedly connected to the hash board... the first heat sink is in direct contact with the first surface
Implementation Method 3
one end of the hash board being an air ingress end and the other opposite end of the hash board being an air egress end, and a heat dissipation channel being formed between the air ingress end and the air egress end
Data Source
Figure 1~2
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AI summary
The present invention provides a hash assembly and an air-cooled server. The hash assembly comprises a hash board and a heat dissipation assembly fixedly connected to the hash board, a surface of the hash board is provided with a plurality of chip columns, each of the chip columns comprises a plurality of chips arranged in a direction of the heat dissipation channel, and the chips in each of the chip columns are arranged from the air ingress end to the air egress end in a dense-to-sparse manner; the heat dissipation assembly comprises at least one first heat sink and a base plate, the base plate has first surface and second surface opposite to each other, the first heat sink is in direct contact with the first surface, and the hash board is in direct contact with the second surface; the heat dissipation assembly further comprises a plurality of heat spreaders which are embedded in the base plate at a side of the base plate away from the hash board, and positions and number of the heat spreaders all correspond one to one with those of the chip columns. The hash assembly and the air-cooled server according to the present invention enable good temperature uniformity of chips during operation.