Liquid-Cooled Hash Board Channels for Bubble-Free Bend Flow
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Solution Overview
Problem
Conventional liquid cooling assemblies experience severe bubble generation at bends in medium flow channels, leading to discrepancies in heat dissipation performance and temperature uniformity across chips in computing devices, particularly affecting ultra-high-performance computing devices.
Innovation Solution
A liquid-cooled computing module with heat dissipation fins configured as contiguous and discontiguous structures at bends, featuring curved and straight plate portions to guide medium flow smoothly, avoiding turbulence and bubble formation, and ensuring uniform flow velocity and temperature across the width of the flow channels.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If conventional liquid cooling assemblies use standard flow channels with bends, then the structure is simple and easy to manufacture, but severe bubble generation occurs at bends causing poor temperature uniformity
Solution Approach 1:
The patent applies curved transitions instead of sharp bends in the flow channels. The curved flow channel transitions smoothly guide the coolant flow, eliminating sudden direction changes that cause bubble generation. This curvature design maintains temperature uniformity across chips while reducing structural complexity compared to multiple sharp angles.
Solution Approach 2:
The patent introduces discontiguous fins at specific locations (bends and turns) of the flow channels, while maintaining contiguous fins in straight sections. This localized modification at critical bubble-generation zones allows targeted bubble suppression without redesigning the entire flow channel structure, balancing temperature uniformity improvement with manufacturing simplicity.
2Manufacturing precision
If wedge-shaped structures are added at bends to guide flow, then bubble generation is reduced somewhat, but temperature uniformity requirements still cannot be satisfied for ultra-high-performance computing
Solution Approach 1:
The patent segments the flow channel structure into different regions with different fin configurations. Discontiguous fins are placed at bends and turns, while contiguous fins are used in straight sections. This segmentation allows optimized local designs at critical locations without complicating the entire structure, achieving better temperature uniformity while maintaining ease of manufacture.
Solution Approach 2:
The curved flow channel design inherently guides flow more effectively than sharp bends, reducing bubble generation at the source. This curvature approach eliminates the need for additional wedge-shaped guide structures, simplifying manufacturing while achieving superior temperature uniformity for ultra-high-performance computing applications.
3Stability of the object's composition
If discontiguous fins with curved portions are used at bends, then bubble generation is avoided and flow velocity uniformity is improved, but the structure becomes more complex
Solution Approach 1:
The patent applies discontiguous fins with curved portions only at specific locations where bubbles are generated (bends and turns), while using simple contiguous fins in straight sections. This localized application of complex geometry only where necessary achieves flow velocity uniformity improvement without unnecessarily complicating the entire fin structure.
Solution Approach 2:
The curved portions of the discontiguous fins smoothly transition between fin segments, eliminating sharp corners that would generate turbulence and bubbles. This curvature design achieves stable flow velocity distribution at bends while the overall fin structure remains relatively simple compared to alternative solutions.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances temperature uniformity among chips, improves operational performance, extends service life, and increases structural strength and anti-noise capabilities of the liquid cooling assembly.
Implementation Method 1
a liquid cooling assembly and a hash board, wherein the hash board includes a substrate and a plurality of chips... the liquid cooling assembly includes an enclosure and heat dissipation fins
Implementation Method 2
heat dissipation fins... disposed closer to the other of the two communicated medium flow channels than the straight plate portions
Implementation Method 3
the curved portions are convex and smooth curved panel structures... the curved portions are disposed closer to the other of the two communicated medium flow channels than the straight plate portions
Data Source
AI summary
Disclosed is a liquid-cooled computing module and a computing device. The liquid-cooled computing module includes a liquid cooling assembly and a hash board. At least two medium flow channels, connected by bends, are formed within the enclosure, and a plurality of heat dissipation fins are juxtaposed within each of the at least two medium flow channels, wherein at a bent connection of two communicated medium flow channels of the at least two medium flow channels, in the plurality of heat dissipation fins within one of the two communicated medium flow channels, some are contiguous fins and some are discontiguous fins, wherein the contiguous fins are arranged contiguously at least at the bent connection, and the discontiguous fins include straight plate portions and curved portions that are spaced apart.