Hash Board Heat Sink Assembly With Spring-Bolt Contact Equalization
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Solution Overview
Problem
Current methods for connecting heat dissipation elements with hash boards require high manufacturing precision, leading to low contact uniformity and tightness, making it inconvenient to manufacture and use.
Innovation Solution
A computing and heat dissipation integrated unit with a heat dissipation assembly featuring protruding ribs and spring bolts that ensure one-to-one contact with chip strips on the hash board, allowing for flexible adjustment of contact tightness and simplifying manufacturing precision requirements.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If high manufacturing precision is required for connecting heat dissipation elements with hash boards, then contact uniformity and tightness improve, but manufacturing complexity and difficulty increase
Solution Approach 1:
The heat dissipation assembly is segmented into multiple independent heat dissipation elements, each corresponding to a specific chip strip. This segmentation allows each element to be independently positioned and contacted with the hash board, ensuring uniform contact without requiring high overall manufacturing precision of the entire assembly.
Solution Approach 2:
The heat dissipation elements are designed with localized contact surfaces that specifically match the chip strip positions on the hash board. This local quality approach ensures that contact uniformity is achieved at the critical interfaces (between heat dissipation elements and chip strips) without requiring high precision across the entire assembly structure.
2Manufacturing precision
If high manufacturing precision is required for connecting heat dissipation elements with hash boards, then contact tightness improves, but ease of manufacture deteriorates
Solution Approach 1:
The heat dissipation elements are designed to self-align and self-contact with the chip strips on the hash board through their geometric configuration. The elements automatically find their correct positions and establish contact without requiring high-precision manual positioning or complex assembly procedures, thereby improving ease of manufacture while maintaining contact tightness.
3Manufacturing precision
If high manufacturing precision is required for connecting heat dissipation elements with hash boards, then heat dissipation effect improves, but manufacturing convenience deteriorates
Solution Approach 1:
By dividing the heat dissipation assembly into multiple discrete elements that independently contact the hash board, the system achieves uniform contact and good heat dissipation effect without requiring high overall manufacturing precision. This segmentation makes the assembly process more convenient and less demanding on manufacturing capabilities.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The solution enhances the uniformity and tightness of contact between the heat dissipation assembly and hash board, improving heat conduction efficiency while reducing manufacturing complexity.
Implementation Method 1
a spring of each of the first spring bolts is pressed against a surface of the first substrate where no first chip strips are arranged
Implementation Method 2
to enable sufficient and rapid heat exchange with these hash boards via the heat dissipation elements
Data Source
AI summary
Disclosure are a computing and heat dissipation integrated unit and an electronic device. The unit includes a first hash board and a heat dissipation assembly. A plurality of first ribs are juxtaposed on a first plate surface of the heat dissipation assembly. The first hash board includes a first substrate, a plurality of first chip strips are arranged on a first surface of the first substrate, and a number of the first chip strips is equal to a number of the first ribs. The first plate surface of the heat dissipation assembly and the first substrate are connected by at least two groups of first spring bolts. Two groups of the at least two groups of first spring bolts are respectively disposed in the first plate surface outside two outermost first ribs.