Hat-Shaped Molding Layer for Power Module Insulation and Heat Dissipation
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Solution Overview
Problem
Power converting circuit packaging modules face challenges in heat dissipation and insulation distance, leading to high production costs due to the need for frequent changes in plastic packaging molds, which limits design optimization and increases costs.
Innovation Solution
A packaging module design featuring a substrate with a power device, pins embedded in a molding layer with a hat-shaped structure that increases creepage distance and includes a hat-brim part to enhance heat dissipation and electrical safety, allowing for reduced packaging size and thickness, and a manufacturing method that uses a panel plastic packaging process to minimize mold updates.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Volume of moving object
If the packaging module size is reduced to increase power density, then the packaging becomes smaller and lighter, but the heat dissipation ability and insulating distance deteriorate
Solution Approach 1:
The patent introduces a hat-shaped molding layer with a hat-brim part that extends laterally to increase the insulating distance and heat dissipation surface area without significantly increasing the overall module height. This dimensional extension in the radial direction allows maintaining compact vertical profile while improving thermal and electrical performance.
Solution Approach 2:
The molding layer is segmented into a main hat-body part and a hat-brim part, where the hat-brim part specifically serves to increase insulating distance and provide heat dissipation path. This segmentation allows independent optimization of different functional regions within the packaging structure.
2Volume of moving object
If the packaging module size is reduced to increase power density, then the packaging becomes smaller and lighter, but the insulating distance deteriorates
Solution Approach 1:
The hat-brim part of the molding layer extends laterally to increase the creepage and clearance distances between conductive parts. This radial extension provides adequate insulating distance while maintaining a compact overall module size, thus improving electrical safety without sacrificing power density.
3Adaptability or versatility
If the plastic packaging mold is changed to accommodate different module sizes, then the design can be optimized, but the production cost increases due to high mold cost
Solution Approach 1:
The hat-shaped molding layer structure serves multiple functions: it provides insulation, heat dissipation, and mechanical protection, while its standardized design allows the same mold to be used for different module sizes. This multi-functionality reduces the need for multiple specialized molds, thereby lowering production costs.
Solution Approach 2:
The patent maintains the same hat-shaped molding layer structure but allows variation in dimensional parameters (such as hat-brim radius and height) to accommodate different module sizes. This parameter adjustment approach enables design flexibility without requiring complete mold redesign, thus balancing adaptability and manufacturing cost.
Data Source
AI summary
The disclosure discloses a packaging module of a power converting circuit and a method for manufacturing the same. The packaging module of the power converting circuit includes a substrate, a molding layer and a plurality of pins. A power device is assembled at the substrate, a plurality of pins electrically are coupled to the power device, the molding layer covers the surface of the substrate with the power device, and at least a contact surface of the pins configured to electrically connect an external circuit is exposed. The molding layer includes a main hat-body part and a hat-brim part, the main hat-body part and the hat-brim part form a hat-shaped molding layer, and the hat-brim part is used to increase a creepage distance between the contact surfaces of the pins located at the top of the molding layer and the bottom of the substrate.