HBM Die Stack Bump Layout for Complete Corner Adhesive Filling
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Solution Overview
Problem
In the manufacturing of high bandwidth memory (HBM) devices, adhesive films used to bond semiconductor chips often flow from the middle to the edge regions, leaving gaps and reducing yield due to insufficient filling in chip corners.
Innovation Solution
A semiconductor package design featuring conductive bumps with specific shapes, including circular and elliptical structures, ensures complete filling of adhesive layers between stacked chips, improving bonding quality and yield.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If adhesive film is used to bond semiconductor chips, then bonding between chips is achieved, but adhesive film does not sufficiently fill chip corners leading to reduced yield
Solution Approach 1:
The conductive bumps are designed with different shapes for different regions: circular bumps in the middle region and elliptical bumps in the diagonal regions extending to corner portions. This local differentiation ensures that the adhesive film flows appropriately to fill spaces in both middle and corner regions, resolving the incomplete filling issue while maintaining bonding quality.
Solution Approach 2:
The conductive bumps exhibit asymmetric distribution and shape variation across the chip surface. The elliptical bumps in diagonal regions have different geometrical properties compared to circular bumps in the middle region, creating asymmetric flow paths for the adhesive film that enable complete filling of corner spaces while maintaining overall bonding reliability.
2Quantity of substance
If adhesive film flows from middle region to edge region, then spaces between chips are filled, but chip corners remain insufficiently filled
Solution Approach 1:
The conductive bumps are designed with different shapes for different regions: circular bumps in the middle region and elliptical bumps in the diagonal regions extending to corner portions. This local differentiation ensures that the adhesive film flows appropriately to fill spaces in both middle and corner regions, resolving the incomplete filling issue while maintaining bonding quality.
Solution Approach 2:
The conductive bumps extend into diagonal regions that reach the corner portions of the chips, adding a dimensional element that guides adhesive flow into previously hard-to-reach corner areas. This spatial extension ensures comprehensive adhesive distribution across the entire chip surface including corners.
Data Source
AI summary
A semiconductor package includes a buffer die; a plurality of core dies sequentially stacked on the buffer die via conductive bumps; and a plurality of adhesive layers between the plurality of core dies, the plurality of adhesive layers filling spaces between the conductive bumps and interconnecting the plurality of core dies; wherein each of the core dies of the plurality of core dies includes a middle region and diagonal regions that extend from the middle region to four corner portions of a respective core die, and wherein the conductive bumps includes: a plurality of first bump structures in the middle region, each first bump structure having a circular shape; and a plurality of second bump structures in each of the diagonal regions, each second bump structure having an elliptical shape.