HBM Semiconductor Chip Heat Dissipation Via Conductive Through-Vias
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Solution Overview
Problem
High bandwidth memory (HBM) semiconductor chips generate significant heat due to the stacking of multiple dynamic random access memories (DRAMs), leading to reduced performance, reliability, and power efficiency, as well as a shortened lifespan if heat dissipation is not efficiently managed.
Innovation Solution
A semiconductor chip design featuring a heat dissipation structure with a conductive layer connected to a through via, and including signal and heat dissipation pads, which efficiently transfers heat away from the chip through a conductive pattern that overlaps these components on a plane.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If multiple DRAMs are stacked to form high bandwidth memory, then memory capacity and bandwidth are expanded, but heat generation increases significantly
Solution Approach 1:
The patent segments the heat dissipation function by introducing separate heat dissipation pads and dedicated heat dissipation structures for each stacked DRAM chip. This allows heat from each individual DRAM to be managed independently through its own heat dissipation path, preventing heat accumulation and improving overall thermal management efficiency while maintaining high bandwidth performance
Solution Approach 2:
The patent introduces heat dissipation pads as intermediary structures between the stacked DRAM chips and the heat dissipation structures. These pads serve as thermal mediators that efficiently transfer heat from the DRAM chips to the heat dissipation structures, which extend toward the heat dissipation chamber, thereby resolving the thermal management challenge associated with high bandwidth memory operation
2Productivity
If heat is not efficiently dissipated, then memory capacity and bandwidth can be maintained, but performance and reliability are reduced
Solution Approach 1:
The heat dissipation pads act as intermediary thermal transfer structures that efficiently conduct heat away from the DRAM chips. By providing dedicated thermal pathways through these pads to the heat dissipation structures, the patent ensures reliable heat removal while maintaining the high bandwidth performance of the stacked memory configuration
Solution Approach 2:
The patent extends heat dissipation structures toward the heat dissipation chamber in the vertical dimension, creating additional thermal pathways that do not interfere with the horizontal signal transmission paths. This dimensional separation allows simultaneous optimization of both bandwidth performance and thermal management reliability
3Temperature
If heat dissipation structures are added, then thermal conductivity is improved by 37%, but device complexity increases
Solution Approach 1:
The patent merges the heat dissipation function with the existing package substrate structure by integrating heat dissipation structures into the substrate and using shared heat dissipation chambers. This consolidation approach achieves the 37% thermal conductivity improvement while minimizing the increase in device complexity by avoiding completely separate heat dissipation systems for each DRAM chip
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The proposed solution effectively enhances heat dissipation in semiconductor chips, improving performance, reliability, and power efficiency, while also extending the lifespan of HBM DRAMs by achieving a 37% increase in thermal conductivity compared to traditional structures.
Implementation Method 1
a heat dissipation structure above the rear surface of the body, and the heat dissipation structure including a conductive layer connected to the through via
Data Source
AI summary
A semiconductor chip including a body that having a front surface and a rear surface; a wiring structure above the front surface of the body; a through via penetrating the body, and the through via is connected to the wiring structure; a heat dissipation structure above the rear surface of the body, and the heat dissipation structure includes a conductive layer connected to the through via; and a signal pad and a heat dissipation pad on the heat dissipation structure, and the signal pad and the heat dissipation pad are connected to the conductive layer.