HBM Bottom-Die Crossbar Layout for Four-Side Die Connectivity

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Solution Overview

Problem

Conventional die-to-die (D2D) connections in high bandwidth memory (HBM) systems are limited by a connectivity wall, preventing additional scale-out in connectivity due to adjacent die sitting on the interposer.

Innovation Solution

Incorporating a configurable cross-bar switch or connection matrix on the HBM bottom die, allowing high bandwidth ingress/egress signaling and enabling connections on all four sides of the HBM device, thereby increasing inter-die bandwidth and flexibility.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Adaptability or versatility

If conventional die-to-die connections are used with adjacent die sitting on the interposer, then the structure is simple and manufacturing is easier, but connectivity is limited by a connectivity wall preventing additional scale-out

Engineering Contradiction:

Improveconnectivity scalabilityVSAvoidinterposer configuration complexity

Core Design Contradiction:

Adaptability or versatilityVSDevice complexity

Solution Approach 1:

The patent enables connections on all four sides of the HBM device by transitioning from a limited connection architecture to a multi-directional connection architecture, effectively adding dimensional freedom to the connectivity layout and breaking the connectivity wall that limited scale-out

Inventive Principle:

Principle #17Another dimension (Dimensionality change)

2Productivity

If connections are enabled on all four sides of the HBM device with configurable cross-bar switch, then inter-die bandwidth and flexibility increase, but device complexity and manufacturing difficulty increase

Engineering Contradiction:

Improveinter-die bandwidthVSAvoidmanufacturing complexity

Core Design Contradiction:

ProductivityVSEase of manufacture

Solution Approach 1:

The configurable cross-bar switch or connection matrix on the HBM bottom die provides multi-functional connectivity capabilities, allowing the same hardware structure to support various connection configurations and enabling high bandwidth ingress/egress signaling through a single integrated component

Inventive Principle:

Principle #6Universality (Multi-functionality)

Data Source

PatentUS20250192106A1System and method for flexible extension of connectivity within an integrated circuit system in a package

Publication Date: 2025.06.12 AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE LTD

AI summary

An integrated circuit package includes a first integrated circuit die, a second integrated circuit die, and a third integrated circuit die. The integrated circuit package also includes a support structure. The first die, the second die, and the third die are attached to the support structure. The first integrated circuit die includes a first interface on a first side of the first integrated circuit die and the second integrated circuit die includes a second interface on a second side of the second integrated circuit die. The first side neighbors the second side. The first integrated circuit die is configured to communicate with second integrated circuit die via the first interface and the second interface. The first integrated circuit die includes a third interface on a third side of the first integrated circuit die and the second integrated circuit die includes a fourth interface on a fourth side of the second integrated circuit die. The third die includes a fifth interface on a fifth side and a sixth interface on sixth side. The sixth side is parallel to the third side and the fifth side, The first integrated circuit die is configured to communicate with the third integrated circuit die via the fifth interface and the third interface. The second integrated circuit die is configured to communicate with the third integrated circuit die via the sixth interface and the fourth interface.