HBM Package Interconnect Using Substrate Traces to Cut Interposer Size
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Solution Overview
Problem
The high cost and warpage issues associated with large silicon interposers used in high-bandwidth memory (HBM) stacks, which increase packaging costs and yield losses due to the need for dense and narrow channels connecting the HBM stack to a logic die, necessitate a more efficient connection solution.
Innovation Solution
The use of wider channels and printed traces, such as organic traces, in place of silicon interposer channels, allowing for a smaller interposer size and reduced material costs, while maintaining effective signal transmission through thicker and wider substrate traces with lower attenuation.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Reliability
If a large silicon interposer is used to accommodate dense interposer channels, then the HBM stack can be connected to the logic die, but the packaging cost increases and the interposer is prone to warpage
Solution Approach 1:
The patent divides the interconnection system into two parts: silicon interposer channels for high-speed logic die connections and organic substrate traces for HBM stack connections. This segmentation allows each part to be optimized independently, reducing the overall interposer size and cost while maintaining connection reliability.
Solution Approach 2:
The patent changes the material parameter from pure silicon interposer to a hybrid system with organic substrate traces. This parameter change reduces material cost and interposer size while the wider trace geometry compensates for potential signal integrity issues.
2Productivity
If narrow interposer channels are used to achieve high channel density, then the HBM stack can be connected, but the interposer size increases and warpage occurs
Solution Approach 1:
The patent transitions from two-dimensional narrow channels in the interposer to wider traces in the organic substrate layer. This dimensional change in the connection path allows higher effective channel density without increasing the interposer area, as the traces can be routed in the substrate plane with larger spacing.
3Productivity
If silicon interposer channels are used for connecting HBM stack, then high density connections are achieved, but material cost and production complexity increase
Solution Approach 1:
The patent replaces expensive silicon interposer channels with cheaper organic substrate traces for the HBM connection portion. The organic substrate acts as a cost-effective interconnection medium that simplifies production while achieving the required connection density.
Data Source
AI summary
An integrated circuit package including a substrate configured to receive one or more high-bandwidth memory (HBM) stacks on the substrate, an interposer positioned on the substrate and configured to receive a logic die on the interposer, a plurality of interposer channels formed in the interposer and connecting the logic die to the one or more HBM stacks, and a plurality of substrate traces formed in the substrate and configured to interface the plurality of interposer channels to the one or more HBM stacks.