HBM Base Die Signal Routing With Shared Data Bumps
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Solution Overview
Problem
Existing high-bandwidth memory devices face challenges in optimizing electrical characteristics and efficient data signal transmission between stacked memory dies and a base die, leading to inefficiencies in signal sharing and power distribution.
Innovation Solution
A memory device design that includes a base die with data signal bumps shared by first and second memory stacks, allowing selective data signal distribution based on selection signals, and a control circuit that manages data and command address signals to individual stacks or dies, enhancing power and signal efficiency.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Device complexity
If data signal bumps are shared between first and second memory stacks, then device complexity is reduced and manufacturing is simplified, but signal transmission efficiency deteriorates due to signal sharing conflicts
Solution Approach 1:
The patent implements dynamic signal routing where the base die selectively connects data signal bumps to either the first memory stack or the second memory stack based on operation type. This dynamic switching mechanism allows the same physical infrastructure to serve different functions at different times, resolving the conflict between shared structure and dedicated performance.
Solution Approach 2:
The patent segments the memory device into distinct first and second memory stacks with separate data signal paths. By dividing the memory access paths and allowing selective activation, the system achieves both the simplicity of shared bumps and the efficiency of dedicated signal transmission when needed.
2Use of energy by moving object
If residual bumps are reallocated for power distribution, then use of energy is improved and power efficiency increases, but device functionality deteriorates due to reduced signal bumps
Solution Approach 1:
The patent makes the data signal bumps multi-functional by enabling them to serve as power distribution bumps during operations where they are not actively transmitting data signals. This universal design allows the same physical structure to fulfill both signal transmission and power distribution functions at different times, maximizing resource utilization without sacrificing functionality.
Solution Approach 2:
The system automatically manages the dual functionality of bumps through self-service mechanisms where the base die intelligently determines when to use bumps for data signals and when to repurpose them for power distribution, eliminating the need for separate dedicated power bumps.
3Productivity
If memory stacks are spaced apart on the base die, then signal transmission efficiency is improved by reducing interference, but device area increases
Solution Approach 1:
The patent transitions from a two-dimensional planar arrangement to a three-dimensional stacked architecture. By stacking memory dies vertically on the base die, the system achieves physical separation and reduced signal interference while maintaining a compact footprint, effectively utilizing the vertical dimension to resolve the area-efficiency conflict.
Data Source
AI summary
A memory device includes a base die that includes a data signal bump configured to receive a data signal, a first memory stack that includes first memory dies sequentially stacked on the base die, and a second memory stack that includes second memory dies sequentially stacked on the base die and spaced from the first memory stack in a direction parallel to an upper surface of the base die. The base die is configured to selectively provide the data signal received through the data signal bump to one of the first memory stack or the second memory stack based on a selection signal.