Oriented hBN Polymer Composite for High In-Plane Thermal Conductivity

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Solution Overview

Problem

There is a need to enhance the thermal management materials in industries such as consumer electronics, telecommunication infrastructure, LED lighting, hybrid and electric vehicles, and solar cells by improving the thermal conductivity of polymer composites.

Innovation Solution

A composite body comprising an organic polymer and hexagonal boron nitride (hBN) particles distributed throughout with a high degree of orientation, achieving thermal conductivities of at least 13.5 W/mK in the in-plane direction, is produced by aligning hBN particles in the x-y direction and using a combination of pressure and polymer curing processes.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If traditional polymer materials are used, then ease of manufacture and processing are maintained, but thermal conductivity is insufficient for effective heat dissipation

Engineering Contradiction:
Improvethermal conductivityVSAvoidmanufacturing complexity
Core Design Contradiction:
TemperatureVSEase of manufacture

Solution Approach 1:

The patent employs composite materials by combining organic polymer matrices with inorganic hexagonal boron nitride (hBN) particles. This composite structure enables the material to achieve high thermal conductivity (exceeding 13.5 W/mK) while maintaining the ease of manufacture and processing characteristics of polymers. The hBN particles serve as thermal conductive fillers within the polymer matrix, creating a hybrid material that overcomes the thermal limitations of pure polymers.

Inventive Principle:
Principle #40Composite materials

Solution Approach 2:

The patent applies parameter changes by modifying the physical and chemical properties of the polymer composite through controlled variation of hBN particle concentration, particle size distribution, and orientation parameters. By optimizing these parameters—specifically achieving at least 50% oriented hBN particles and controlling the volume fraction between 30-90%—the thermal conductivity is enhanced to exceed 13.5 W/mK while maintaining manufacturability through established polymer processing techniques.

Inventive Principle:
Principle #35Parameter changes

2Temperature

If hBN particles are added to enhance thermal conductivity, then heat dissipation capability is improved, but manufacturing process complexity increases due to particle alignment requirements

Engineering Contradiction:
Improveheat dissipation capabilityVSAvoidprocess complexity
Core Design Contradiction:
TemperatureVSDevice complexity

Solution Approach 1:

The patent applies preliminary action by incorporating hBN particles into the polymer matrix in a pre-dispersed state before final forming operations. The particles are mixed and distributed uniformly throughout the polymer compound prior to molding or shaping, which simplifies the overall manufacturing process. This preliminary dispersion step ensures homogeneous thermal conductivity throughout the final product without requiring complex post-processing alignment equipment.

Inventive Principle:
Principle #10Preliminary action

Solution Approach 2:

The patent implements local quality by creating regions of high hBN particle concentration and orientation where heat dissipation is most critical. The composite structure allows for spatial variation in thermal conductivity, with oriented hBN particles (at least 50% orientation) providing enhanced thermal pathways in specific directions. This localized enhancement of thermal properties allows the material to achieve superior heat dissipation capability (thermal conductivity > 13.5 W/mK) in critical areas while maintaining simpler processing overall.

Inventive Principle:
Principle #3Local quality

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The composite body achieves high thermal conductivity, effectively dissipating heat and prolonging the life of electrical devices by enhancing thermal management capabilities.

Implementation Method 1

a composite body including an organic polymer and ceramic particles comprising hexagonal boron nitride (hBN) particles distributed throughout the organic polymer... achieving thermal conductivities of at least 13.5 W/mK in the in-plane direction

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Data Source

PatentUS12559661B2Composite body having high thermal conductivity and method of making the composite body
Publication Date: 2026.02.24 SAINT GOBAIN CERAMICS & PLASTICS INC
  • US12559661B2 patent drawing
  • US12559661B2 patent drawing
  • US12559661B2 patent drawing

AI summary

A composite article can comprise a composite body including an organic polymer and ceramic particles comprising hexagonal boron nitride (hBN) particles distributed throughout the organic polymer, wherein an amount of the hBN particles ranges from 40 vol % to 90 vol % based on a total volume of the body; and the body comprises an in plane thermal conductivity of at least 15 W/mK. The hBN particles within the composite body can have a March-Dollase Orientation parameter η of at least 50%.