Hard Disk Drive Buffer Adhesive Detachment for Impact Resistance
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Solution Overview
Problem
Existing electronic apparatuses, such as notebook personal computers, face challenges in maintaining the positioning of buffer members during vibrations or impacts, leading to ineffective protection of components like hard disk drives due to shifts in position between the buffer members and the storage part.
Innovation Solution
The use of pressure-sensitive adhesive materials with varying adhesive forces between buffer members and the component, allowing for detachment and re-adhesion to absorb and dissipate impact energy, thereby maintaining component positioning and enhancing impact resistance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Stability of the object's composition
If adhesive is used to fix the buffer members to the component, then the positioning stability is improved, but the impact absorption capability deteriorates due to restricted relative movement
Solution Approach 1:
The adhesive bonding system is segmented into multiple independent adhesive members (first adhesive member, second adhesive member, third adhesive member) positioned at different locations. Each adhesive member can independently detach and re-adhere, allowing the system to maintain overall positioning stability while enabling localized movement for impact absorption.
Solution Approach 2:
The adhesive bonding transitions from a static fixed state to a dynamic state where adhesive members can detach and re-adhere based on impact conditions. This dynamic behavior allows the buffer member to move relative to the component during impact events, absorbing impact energy while maintaining positioning during normal operation.
2Stability of the object's composition
If the buffer member is firmly fixed to prevent position shift, then the positioning stability is improved, but the vibration damping capability deteriorates due to restricted relative movement
Solution Approach 1:
The adhesive bonding system is divided into multiple segmented adhesive members that can independently respond to vibration and impact forces. This segmentation allows certain areas to remain firmly bonded for positioning stability while other areas can detach and re-adhere to provide vibration damping through controlled relative movement.
Solution Approach 2:
The adhesive bonding characteristics change dynamically based on applied forces. During normal operation, the adhesive maintains strong bonding for positioning stability. During vibration or impact events, the adhesive parameters change as members detach and re-adhere, enabling vibration damping capability while maintaining overall positioning.
3Reliability
If weak adhesive bonding is used to allow relative movement, then the impact absorption capability is improved, but the positioning stability deteriorates
Solution Approach 1:
The adhesive bonding system uses multiple segmented adhesive members with different bonding strengths and characteristics at different locations. This segmentation allows the system to achieve both weak bonding (for impact absorption) and strong bonding (for positioning stability) simultaneously by distributing adhesive members strategically throughout the buffer member structure.
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
This configuration improves the impact resistance of electronic apparatuses by effectively absorbing and dissipating external disturbances, reducing the risk of component damage from vibrations and impacts through controlled detachment and re-adhesion mechanisms.
Implementation Method 1
a pressure-sensitive adhesive material disposed between the component and the second surface for positioning the component and the second surface. The pressure-sensitive adhesive material becomes detached when the first buffer member contracts such that a thickness of the first buffer member becomes a post-contraction length T4 from a natural length T1
Data Source
AI summary
Buffer materials 7 and a lower principal surface 6a of a hard disk case 6, and the buffer materials 7 and a hard disk drive 5, are adhesively fixed to each other by strong pressure-sensitive adhesive forces. Pressure-sensitive adhesive materials 8 are provided between the hard disk drive 5 and an upper principal surface 6b of the hard disk case 6. The pressure-sensitive adhesive force of each pressure-sensitive adhesive material 8 is weak to such a degree that the pressure-sensitive adhesive material 8 becomes detached by a contraction force of each buffer material 7. Thus, when external disturbance is applied to the hard disk drive 5, each pressure-sensitive adhesive material 8 becomes detached during contraction of each buffer material 7. The contraction of each buffer material 7 and the detachment of each pressure-sensitive adhesive material 8 allow improvement of the impact resistance of the hard disk drive 5.