Hard Disk Drive Nozzle Tip with Chamfered Geometry for Soldering
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Solution Overview
Problem
Existing nozzles for connecting or disconnecting solder joints between head bonding pads in hard disk drives face interference issues with adjacent elements, such as piezoelectric arms and laser diode units, leading to reduced precision and assembly yield due to limited space and interference during soldering or reflowing operations.
Innovation Solution
A nozzle with an interference-free structure, featuring chamfer-cuts or step-cuts on its tip, which reduces the outer circumference and prevents interference with adjacent elements, maintaining a safe clearance for high precision and speed in soldering or reflowing operations.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Manufacturing precision
If the nozzle tip is positioned close to the bonding pads for high precision soldering, then soldering precision is improved, but the nozzle tip interferes with adjacent elements such as piezoelectric arms and laser diode units
Solution Approach 1:
The nozzle tip is designed with a chamfered conical structure that changes the spatial dimension of the tip geometry. The chamfer creates a sloped surface that allows the nozzle to approach the bonding pad from an angled direction rather than a direct perpendicular approach, thereby avoiding interference with adjacent elements while maintaining positioning precision.
Solution Approach 2:
The chamfer is applied specifically to the tip region of the nozzle, creating a localized geometric modification. This local quality change allows the tip to have different functional surfaces: the chamfered outer surface for avoiding interference and the inner bore for precise solder delivery, thus resolving the contradiction between precision and interference avoidance.
2Object-affected harmful factors
If the nozzle tip is moved away from the slider to avoid interference with adjacent elements, then interference is eliminated, but soldering precision and alignment are reduced
Solution Approach 1:
The chamfered conical tip transforms the nozzle's approach geometry from a direct lateral approach to an angled approach. This dimensional change in the tip geometry allows the nozzle to maintain close proximity to the bonding pad while the chamfered surface profile prevents contact with adjacent elements, thereby preserving precision without causing interference.
3Reliability
If the nozzle tip has a larger outer circumference for structural integrity, then manufacturing reliability is improved, but interference with adjacent elements occurs due to limited space
Solution Approach 1:
The chamfered conical tip modifies the radial dimension of the nozzle tip by creating a sloped surface. This geometric transformation reduces the effective outer circumference at the critical tip region compared to a cylindrical tip, allowing the nozzle to fit into the limited space without interfering with adjacent elements while maintaining sufficient structural integrity through the conical geometry.
Data Source
AI summary
A nozzle for connecting or disconnecting solder joints between head bonding pads of in a hard disk drive, includes a nozzle body including a tip, the tip disposed at a distal end of the nozzle body and configured to deliver or reflow a solder ball in proximity to head bonding pads; and a central duct disposed along a central axis of the nozzle body and configured to convey the solder ball to or from the tip. The tip includes a front face facing to a trailing edge of a slider, a back face facing to a top surface of a suspension supporting the slider, and two side faces adjacent to the front face and back face respectively, and at least one interference-free structure is provided at two adjacent faces of the tip at least, thereby no interference happens between the tip and elements adjacent to the slider during the operation.