HDF Mid-Layer Composite Wood Board Preventing Telegraphy

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Solution Overview

Problem

Engineered floor boards with OSB substrates face issues such as swelling, delamination, and telegraphy due to variable density and irregular surfaces, leading to cost inefficiencies and aesthetic problems when bonded with thin quality wood layers.

Innovation Solution

A composite engineered wood material piece featuring a thin quality wood top layer bonded to an OSB bottom layer through a high-density fiber (HDF) mid-layer, which acts as a strengthening and transition layer, preventing telegraphy and enhancing bonding while maintaining cost-effectiveness.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Ease of manufacture

If OSB is used as a substrate to reduce costs, then fabrication cost is reduced, but the irregular surface and variable density cause telegraphy and delamination

Engineering Contradiction:

Improvefabrication costVSAvoidbonding stability

Core Design Contradiction:

Ease of manufactureVSReliability

Solution Approach 1:

The patent introduces an intermediate layer between the OSB substrate and the thin quality wood top layer. This intermediate layer serves as a mediator that smooths the irregular OSB surface and provides a stable bonding interface, preventing telegraphy while maintaining the cost benefits of using OSB as the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent creates a composite structure combining OSB substrate with an intermediate layer and thin quality wood top layer. This composite material approach allows the benefits of each material (cost-effectiveness of OSB, aesthetic quality of thin wood layer) to be combined while mitigating the weaknesses (irregular surface, delamination risk) through proper material selection and layering.

Inventive Principle:

Principle #40Composite materials

2Ease of manufacture

If OSB is used as a substrate, then cost is reduced, but swelling under humid conditions occurs

Engineering Contradiction:

Improvefabrication costVSAvoidswelling under humidity

Core Design Contradiction:

Ease of manufactureVSObject-affected harmful factors

Solution Approach 1:

The intermediate layer acts as a protective barrier between the OSB substrate and the environment, reducing the direct impact of humidity on the OSB. This mediator layer helps prevent swelling while maintaining the cost advantages of using OSB as the substrate.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The patent modifies the overall structure by adding an intermediate layer with different dimensional stability characteristics, effectively changing the hygroscopic parameters of the composite structure to reduce swelling under humid conditions.

Inventive Principle:

Principle #35Parameter changes

3Ease of manufacture

If thin quality wood layer is used to reduce cost, then material cost is reduced, but the layer is more susceptible to telegraphy and distortion

Engineering Contradiction:

Improvematerial costVSAvoidsurface flatness

Core Design Contradiction:

Ease of manufactureVSManufacturing precision

Solution Approach 1:

The intermediate layer serves as a cushioning mediator between the thin quality wood top layer and the irregular OSB substrate. This mediator absorbs and distributes stresses, preventing telegraphy and distortion from propagating to the thin top layer, thereby maintaining surface flatness while using cost-effective thin wood material.

Inventive Principle:

Principle #24Intermediary (Mediator)

Solution Approach 2:

The intermediate layer provides beforehand cushioning to the thin quality wood top layer, protecting it from the irregularities and stresses of the OSB substrate before they can cause telegraphy or distortion. This preventive measure maintains surface quality while allowing the use of thinner, more cost-effective wood material.

Inventive Principle:

Principle #11Beforehand cushioning (Prior cushioning)

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The HDF mid-layer improves bonding and stress resistance, allowing for increased board thickness while preventing surface irregularities from affecting the quality wood top layer, thus enhancing durability and aesthetic appeal while reducing fabrication costs.

Implementation Method 1

a thin quality wood top layer bonded to an OSB bottom layer through a high-density fiber (HDF) mid-layer

Methodology Applied

Scientific EffectAdhesive bonding: Adhesive

Implementation Method 2

The middle layer resists to stress exhibited by the top layer and provides improved bonding to the bottom layer

Methodology Applied

Scientific EffectStress distribution:

Data Source

PatentUS9487958B2Composite engineered wood material piece composed of an HDF mid-layer and an OSB bottom layer

Publication Date: 2016.11.08 BOA FRANC S E N C

AI summary

A composite engineered wood material piece, such as a floor board or wood material sheet, is comprised of a thin top quality wood material layer bonded onto a high density fiber board (HDF) material which is itself bonded onto a thick bottom substrate oriented strand board (OSB) material layer. The OSB material layer has its particle orientation in the top surface disposed parallel to the grain orientation in the top quality wood material layer. The HDF layer resists to the stress exhibited in the top layer and acts has a transition layer to secure the top layer to the bottom layer. It also strengthens the composite floor board or wood material sheet.