HDMI 2.1 Connector Terminal Layout for High-Frequency Transmission
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Solution Overview
Problem
The increased complexity of the terminal structure required for the HDMI 2.1 specification, necessitating at least two sets of different molds, results in higher manufacturing costs and difficulties in mold design due to the higher data transmission bandwidth and added features like HDR and low-latency technologies.
Innovation Solution
An electrical connector with an insulating body, multiple terminals, and a metallic shell, featuring specific terminal arrangements and widths to meet high-frequency signal transmission requirements, including interleaved rows of terminals with varying widths for data transmission and optimized pin assignments, along with enlarged openings to reduce impedance.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Power
If the terminal structure is designed to meet HDMI 2.1 specification requirements, then the data transmission bandwidth is improved, but the device complexity increases and manufacturing costs increase
Solution Approach 1:
The patent applies universality by designing a single mold structure that can produce both HDMI 2.0 and HDMI 2.1 connectors. The terminal structure uses a standardized insulating body with terminal holes that can accommodate different terminal configurations through selective formation of conductive patterns, allowing one mold to serve multiple product generations and specifications.
Solution Approach 2:
The patent applies parameter changes by modifying the conductive pattern parameters (copper foil layout, terminal width, spacing) within the same mold structure to produce different terminal configurations. The insulating body maintains fixed geometric parameters while the conductive patterns are adjusted to meet different bandwidth requirements, enabling flexible adaptation to HDMI 2.0 or 2.1 specifications.
2Power
If the terminal structure is designed to meet HDMI 2.1 specification requirements, then the data transmission bandwidth is improved, but the manufacturing costs increase
Solution Approach 1:
The patent applies universality by designing a single mold structure that can produce both HDMI 2.0 and HDMI 2.1 connectors. The terminal structure uses a standardized insulating body with terminal holes that can accommodate different terminal configurations through selective formation of conductive patterns, allowing one mold to serve multiple product generations and specifications.
Solution Approach 2:
The patent applies merging by combining the production capability for both HDMI 2.0 and HDMI 2.1 connectors into a single mold system. The insulating body, terminal holes, and basic structural elements are merged into one standardized design, while the conductive patterns are varied to achieve different functionality, reducing the need for separate manufacturing tooling.
3Power
If the terminal structure is designed to meet HDMI 2.1 specification requirements, then the data transmission bandwidth is improved, but the difficulty of mold design increases
Solution Approach 1:
The patent applies segmentation by separating the mold design into two independent parts: the insulating body structure (which remains standardized and simple) and the conductive pattern layer (which varies to meet different specifications). This segmentation allows the complex bandwidth requirements to be addressed through pattern design rather than structural redesign, simplifying the overall mold design process.
Solution Approach 2:
The patent applies parameter changes by modifying the conductive pattern parameters (copper foil layout, terminal width, spacing) within the same mold structure to produce different terminal configurations. The insulating body maintains fixed geometric parameters while the conductive patterns are adjusted to meet different bandwidth requirements, enabling flexible adaptation to HDMI 2.0 or 2.1 specifications.
Data Source
AI summary
An electrical connector with HDMI 2.1 specification, including an insulating body, multiple terminals, and a metallic shell partially enclosing the insulating body and the terminals, is provided. The terminals include ten terminals located in an upper row and nine terminals located in a lower row. The ten terminals are sequentially a first terminal Data2+, a third terminal Data2−, a fifth terminal Data Shield, a seventh terminal Data0+, a ninth terminal Data0−, a eleventh terminal Data3 Shield, a thirteenth terminal CEC, a fifteenth terminal SCL, a seventeenth terminal DDC/CEC Ground, and a nineteenth terminal Hot Plug Detec1 along an arrangement direction. The nine terminals are sequentially a second terminal Data2 Shield, a fourth terminal Data1+, a sixth terminal Data1−, an eighth terminal Data0 Shield, a tenth terminal Data3+, a twelfth terminal Data3−, a fourteenth terminal Utility, a sixteenth terminal SDA, and an eighteenth terminal +5V Power along the arrangement direction.