HDPC Engineered Plank Thermal Compression Bonding

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Solution Overview

Problem

Existing wood-plastic composite (WPC) flooring technologies face issues such as resource waste, finish quality problems, and increased processing complexity due to the use of wood powder and glue-based manufacturing processes, which affect the rigidity and durability of flooring planks.

Innovation Solution

The development of a High Density Plastic Composite (HDPC) engineered plank with a rigid core, produced by extruding a mixture of polyvinyl chloride powder, whiting, and other additives without the use of glue, and bonding the surface layer using thermal compression, allowing for continuous production and improved stability.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Loss of substance

If wood powder is used in WPC substrate, then resource utilization is improved, but finish quality deteriorates and mustiness occurs

Engineering Contradiction:
Improveresource wasteVSAvoidfinish quality and mustiness
Core Design Contradiction:
Loss of substanceVSObject-affected harmful factors

Solution Approach 1:

The patent removes wood powder from the substrate composition entirely, extracting the problematic component that causes finish quality issues and mustiness. The substrate is reformulated using only plastic materials (PVC, calcium carbonate, and other additives) without any wood content, thereby eliminating the harmful effects while maintaining resource efficiency through the use of recyclable plastic materials.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent creates a new composite material formulation for the substrate using plastic materials instead of wood-plastic composite. The substrate consists of PVC powder, calcium carbonate (whiting), and various additives mixed in specific proportions to achieve the desired mechanical properties without wood content, thus resolving the finish quality and mustiness problems.

Inventive Principle:
Principle #40Composite materials

2Strength

If glue is used to bond surface layer to substrate, then bonding strength is improved, but manufacturing complexity and processing steps increase

Engineering Contradiction:
Improvebonding strengthVSAvoidmanufacturing complexity
Core Design Contradiction:
StrengthVSDevice complexity

Solution Approach 1:

The patent removes the glue component from the manufacturing process entirely. Instead of using adhesive to bond the surface layer to the substrate, the invention uses a thermal compression welding process that directly fuses the layers together through heat and pressure, eliminating the need for separate gluing operations and reducing manufacturing complexity.

Inventive Principle:
Principle #2Taking out (Extraction)

Solution Approach 2:

The patent replaces the chemical bonding mechanism (glue) with a thermal-mechanical bonding mechanism. The surface layer and substrate are bonded through thermal compression that melts and fuses the materials together, substituting the chemical adhesive system with a physical thermal processing system that achieves stronger bonding without additional processing steps.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

3Manufacturing precision

If multiple processing steps are used including coating process, then product quality is improved, but productivity decreases

Engineering Contradiction:
Improveproduct qualityVSAvoidproduction efficiency
Core Design Contradiction:
Manufacturing precisionVSProductivity

Solution Approach 1:

The patent merges multiple processing steps into a single integrated thermal compression operation. The bonding of the surface layer to the substrate, along with any necessary finishing operations, is accomplished in one continuous process step rather than through separate coating, drying, and bonding operations, thereby maintaining product quality while significantly improving productivity.

Inventive Principle:
Principle #5Merging (Combining)

Solution Approach 2:

The patent implements a continuous manufacturing process where the thermal compression bonding occurs continuously as the planks are being formed, rather than requiring intermittent stopping for separate coating and bonding steps. This continuous action maintains quality standards while maximizing production efficiency and throughput.

Inventive Principle:
Principle #20Continuity of useful action

4Strength

If high-pressure press is used to press slabs together, then bonding strength is improved, but energy consumption increases

Engineering Contradiction:
Improvebonding strengthVSAvoidenergy consumption
Core Design Contradiction:
StrengthVSUse of energy by stationary object

Solution Approach 1:

The patent changes the bonding parameters from high-pressure mechanical pressing to thermal compression at moderate pressure. By using heat to soften and fuse the materials, the process achieves strong bonding at lower pressure levels, thereby reducing energy consumption while maintaining or improving bonding strength compared to traditional high-pressure mechanical pressing.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

This solution results in a more durable and efficient manufacturing process with reduced waste, enhanced rigidity, and improved stability, eliminating the need for wood powder and adhesive-related issues, while enabling continuous production and automated manufacturing.

Implementation Method 1

The mixture is then extruded through an extruder compound to form a plastic composite base material

Methodology Applied
Scientific EffectExtrusion: Extrusion

Implementation Method 2

A surface layer is then fused onto the plastic composite base material using thermal compression, without the use of intermediate adhesive materials

Methodology Applied
Scientific EffectThermal compression: Compression

Data Source

PatentUS11975510B2Engineered plank and its manufacturing method
Publication Date: 2024.05.07 AHF IC LLC
  • US11975510B2 patent drawing
  • US11975510B2 patent drawing
  • US11975510B2 patent drawing

AI summary

A plank is described and a method for manufacturing the plank. The plank can be produced by mixing polyvinyl chloride powder, coarse whiting and light calcium compound powder, stabilizer, polyethylene wax, internal lubricant, plasticizer, and impact modifier together, and stirring this mixture. The mixture is then extruded through an extruder compound to form a plastic composite base material. A surface layer is then tiled onto the plastic composite base material using thermal compression, without the use of intermediate adhesive materials. The surface layer can be embossed when it is combined with the mixture being extruded.