Hydrogen Evolution Assisted Electroplating Nozzle for Rapid Circuit Prototyping
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Solution Overview
Problem
Current 3D printing methods struggle to efficiently prototype electronic circuits due to unsuitable patterning methods for sensitive circuits, high costs, and the challenge of soldering electronic components on low-melting-point plastic substrates without damaging the structure.
Innovation Solution
The development of a hydrogen evolution assisted (HEA) electroplating method for rapid and localized electrochemical copper deposition in 3D printed structures, enabling the direct integration of electronic circuits into larger 3D printed structures and allowing for low-temperature soldering of surface mount electronic devices.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Productivity
If conventional electroplating methods are used for copper deposition in 3D printed structures, then the process is compatible with existing technology, but the deposition rate is slow and inefficient
Solution Approach 1:
The patent changes the electrochemical parameters by applying a high current density (10-100 mA/cm²) to enable hydrogen evolution reaction alongside copper deposition. This parameter change transforms the conventional slow electroplating process into a rapid HEA electroplating process, achieving deposition rates up to 100 times faster than conventional methods while maintaining copper layer quality
Solution Approach 2:
The patent replaces the conventional mechanical/electrical electroplating system with an electrochemical system that utilizes hydrogen evolution reaction. By substituting the traditional pure copper ion reduction mechanism with a hydrogen-assisted electrochemical process, the system achieves dramatically enhanced deposition rates without requiring complex mechanical adjustments
2Reliability
If conventional soldering methods are used on 3D printed plastic substrates, then electronic components can be soldered, but the high temperature damages the plastic structure
Solution Approach 1:
The patent introduces a copper layer as an intermediary between the plastic substrate and electronic components. This copper intermediary serves dual purposes: it provides a thermally stable surface for reliable soldering while protecting the underlying plastic substrate from direct exposure to high soldering temperatures, thus preventing thermal damage
Solution Approach 2:
The patent performs preliminary copper deposition on the plastic substrate before soldering electronic components. This preliminary action creates a thermal barrier layer that protects the plastic from subsequent high-temperature soldering processes, enabling reliable component attachment without substrate damage
3Ease of manufacture
If existing patterning methods are used for conductive materials in 3D printed structures, then circuits can be formed, but the methods are either not suitable for sensitive electronic circuits or too expensive
Solution Approach 1:
The patent utilizes the 3D printed conductive tracks themselves as the cathode substrate for copper deposition. The printed tracks serve dual functions: as the structural support and as the electrochemical substrate for metal deposition. This self-service approach eliminates the need for separate expensive patterning processes while ensuring compatibility with sensitive circuits through precise localized deposition
Applied Scientific Principles
This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.
Function Achieved in This Case
The HEA electroplating method significantly enhances the deposition rate, enabling fast printing of copper tracks and reliable soldering of electronic components at room temperature, thus overcoming the limitations of existing 3D printing technologies for electronic circuit prototyping.
Implementation Method 1
rapid and localized electrochemical copper deposition
Implementation Method 2
hydrogen evolution assisted (HEA) electroplating
Implementation Method 3
electrolyte and anode, the inner coaxial tube configured to dispense the electrolyte
Data Source
AI summary
A hydrogen evolution assisted electroplating nozzle includes a nozzle tip configured to interface with a portion of a substructure. The nozzle also includes an inner coaxial tube connected to a reservoir containing an electrolyte and an anode, the inner coaxial tube configured to dispense the electrolyte through the nozzle tip onto the portion of the substructure. The nozzle also includes an outer coaxial tube encompassing the inner coaxial tube, the outer coaxial tube configured to extract the electrolyte from the portion of the substructure. The nozzle also includes at least one contact pin configured to make electrical contact with a conductive track on the substrate.