Head Assembly Water Cooling Eliminates Ink Mist

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Solution Overview

Problem

Existing head assemblies face issues with ink mist generation during printing, which can lead to dirtiness within the assembly and printing apparatus due to air flow from fans used for cooling, causing ink droplets to be thrown upward and potentially dirtying the components.

Innovation Solution

A head assembly incorporating a water-cooling system to efficiently cool power sources mounted on substrates, preventing the upward movement of ink mist droplets by eliminating the need for air cooling, thus minimizing dirt accumulation.

Engineering Contradictions & Design Principles

VSEngineering Contradiction Analysis

1Temperature

If a fan is used to cool the power source, then cooling effect is achieved, but ink mist is thrown upward and dirtiness occurs

Engineering Contradiction:
Improvepower source temperatureVSAvoidink mist dirtiness
Core Design Contradiction:
TemperatureVSObject-affected harmful factors

Solution Approach 1:

The patent replaces the mechanical air-cooling system (fan) with a water-cooling system. The cooler includes a water cooling block that contacts the substrate, and cooling water flows through channels in the block to remove heat from the power source, eliminating the fan that causes ink mist to be thrown upward.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent uses a hydraulic cooling system where cooling water flows through channels in the water cooling block to transfer heat away from the power source. This hydraulic approach replaces the pneumatic fan-based cooling, preventing ink mist from being dispersed by air flow.

Inventive Principle:
Principle #29Pneumatics and hydraulics

2Loss of energy

If air flow is generated for cooling, then heat dissipation is improved, but ink droplets are raised and dirt accumulation increases

Engineering Contradiction:
Improveheat dissipation efficiencyVSAvoidink droplet raising
Core Design Contradiction:
Loss of energyVSObject-generated harmful factors

Solution Approach 1:

The patent substitutes the mechanical fan system with a water-based thermal conduction system. The water cooling block conducts heat away from the power source through thermal contact, eliminating the need for air flow generation that would otherwise raise ink droplets.

Inventive Principle:
Principle #28Mechanics substitution (Replace mechanical system)

Solution Approach 2:

The patent changes the cooling medium from air to water, fundamentally altering the heat transfer mechanism. Water's higher heat capacity and thermal conductivity enable more efficient heat dissipation without generating the air flow that causes harmful ink droplet raising.

Inventive Principle:
Principle #35Parameter changes

Applied Scientific Principles

This section explains which scientific principles are used to turn an abstract innovation direction into a practical engineering solution.

Function Achieved in This Case

The water-cooling system effectively suppresses the raising of ink mist droplets during printing, preventing dirtiness within the head assembly and printing apparatus, while ensuring efficient cooling of power sources.

Implementation Method 1

a water cooling block configured to cool the power source

Methodology Applied
Scientific EffectThermal conduction: Conduction (thermal)

Implementation Method 2

a cooler configured to cool the power source mounted on each of the plurality of substrates

Methodology Applied
Scientific EffectHeat exchange: Heat Exchanger

Data Source

PatentUS20240326421A1Head assembly
Publication Date: 2024.10.03 BROTHER KOGYO KK
  • US20240326421A1 patent drawing
  • US20240326421A1 patent drawing
  • US20240326421A1 patent drawing

AI summary

There is provided a head assembly including: a head group including a plurality of heads each of which has a plurality of pressure generators, each of the plurality of pressure generators having one of a plurality of electrodes; a substrate group including a plurality of substrates each of which corresponds to and is electrically connected to one of the plurality of heads of the head group; and a cooler of a water-cooling system, wherein each of the plurality of substrates included in the substrate group has a power source mounted thereon, the power source being configured to be connected to the plurality of electrodes of a head which is included in the plurality of heads and which corresponds to each of the plurality of substrates; and the cooler is configured to cool the power source which is mounted on each of the plurality of substrates.