Head Camera Integration for Electronic Component Mounting Precision
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Solution Overview
Problem
Existing electronic component mounting apparatuses require complex structures and increased production time due to the need for additional camera mechanisms to photograph substrates and components, leading to inefficiencies in image processing and component mounting.
Innovation Solution
An electronic component mounting apparatus with a head camera unit integrated into the head, allowing for simultaneous image synthesis and control of nozzle operations, including fluxer application, to enhance productivity by streamlining the mounting process.
Engineering Contradictions & Design Principles
Engineering Contradiction Analysis
1Measurement precision
If another camera moving mechanism is added to photograph images with cameras not provided on a head, then image checking capability is improved, but device complexity increases
Solution Approach 1:
The patent integrates the camera unit directly into the head structure, merging the imaging function with the component pickup function. This eliminates the need for separate camera moving mechanisms and reduces device complexity while maintaining image checking capability.
Solution Approach 2:
The head is designed to perform multiple functions: both picking up electronic components and photographing them for inspection. This multi-functionality eliminates the need for dedicated inspection equipment, simplifying the overall device structure.
2Measurement precision
If images are photographed by cameras not provided on a head, then image checking capability is improved, but production time increases
Solution Approach 1:
The integrated camera allows for continuous imaging during the component pickup and placement process. Images are captured without interrupting the mounting workflow, eliminating the time loss associated with separate inspection steps.
Solution Approach 2:
Images are photographed in advance during the pickup process before the component is placed on the substrate. This preliminary imaging eliminates the need for post-placement inspection, reducing overall production time.
3Area of stationary object
If a separate camera moving mechanism is added, then image coverage is improved, but device complexity increases
Solution Approach 1:
The camera unit is merged with the head structure, utilizing the head's own movement and positioning capabilities to achieve comprehensive image coverage without requiring additional moving mechanisms.
Data Source
AI summary
An electronic component mounting apparatus includes an electronic component supply device for supplying an electronic component, a head including a head main body and a head camera unit, and a control device. The head main body includes nozzles, a nozzle drive unit for driving the nozzles and a head support body for supporting the nozzles and the nozzle drive unit. The head camera unit is fixed to the head support body and has head cameras corresponding to the nozzles respectively for photographing electronic components. The head drives the nozzles to hold the electronic components, transfers the electronic components from the electronic component supply device to the substrate and mounts the electronic components onto the substrate. The control device synthesizes images photographed by the head cameras to generate an image with fields of the head cameras connected together, and determines a process based on the synthesized image synthesized.